Waferpedia

Comparison ledger

321versusDAD 3221 Automatic Dicing

Disco 321, Disco DAD 3221 Automatic Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
321Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco 321Disco DAD
Specifications
OEMDisco[1]—
Model321[1]DAD 3221[4]
Equipment typeWafer Dicing Saw[1]—
Facility contextCleanroom Instrumentation[1]—
Application areaNano and Micro Fabrication[1]—
LocationFNT 4.106[1]—
Wafer SizeUp to 6 inches[2]—
Spindle Power1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[3]—
Spindle Power (alternate)1500 Watt spindle[2]—
Non-Contact SetupNon Contact Setup[3]—
MicroscopeMicroscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[3]—
Broken Blade DetectionBroken Blade Detection[3]—
Light TowerIncludes Light Tower[3]—
Chuck Type6" Universal Chuck (or 6" Porous Film Frame Chuck)[2]—
Wafer size capabilityUp to 6" wafers[3]—
Chuck6-inch porous film frame chuck[2]—
Spindle power1500-watt spindle[2]2.0 kW (standard), 1.8 kW (option)[5]
FootprintSmall footprint[2]—
SetupNon-contact setup[3]—
Blade break detectionBroken blade detection[3]—
Other featuresFloppy drive, light tower, blade tools, manuals[3]—
Power—2000W synchro spindle (3.000 – 40.000 rpm)[4]
Configuration—6” porous chuck table for 6” frames[4]
Machine dimensions—490mm x 870mm x 1.670mm[4]
Make—Disco[4]
Machine type—Automatic Dicing Saw[4]
Wafer size—6 inch[4]
Spindle layout—Single[5]
Spindle output—2000 W synchro spindle[4]
Spindle speed range—3,000–40,000 rpm[4]
Chuck table—6-inch porous chuck table for 6-inch frames[4]
Max workpiece size—Φ6 inch; optional 150 mm × 150 mm user-specified specification[5]
X-axis cutting range—160 mm[5]
Y-axis cutting range—162 mm[5]
Equipment dimensions—490 mm × 870 mm × 1,670 mm[4]
Internal transformer / power—380–420 V, 3 phases, 50 Hz[4]
CE marking—2022[4]
Z-axis max stroke—32.2 mm (for 2 inch blades)[5]
θ-axis max rotating angle—320 deg[5]
Machine dimensions (W×D×H)—490 mm × 870 mm × 1,670 mm[5]
Machine weight—approx. 420 kg[5]
Microscope magnification—7.5x with 1/2 inch CCD, field of view 0.64 mm[4]
LCD monitor—15 inch[4]
Power supply—380-420 V, 3 phases, 50 Hz (internal transformer)[4]
X-axis cutting speed—0.1 – 800 mm/s[5]
Y-axis index step—0.0001 mm[5]
Y-axis positioning accuracy—0.005 mm / 160 mm (single error)[5]
Z-axis moving resolution—0.000002 mm[5]
Z-axis repeatability accuracy—0.001 mm[5]
Rated torque (2.0 kW spindle)—0.48 N·m[5]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]tmi.utexas.edutmi.utexas.edu
  2. [2]jmind.comjmind.com
  3. [3]gtsaz.comgtsaz.com
  4. [4]inventory listing
  5. [5]web.archive.orgweb.archive.org