Comparison ledger
Disco 321, Disco KR15, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 321Disco | KR15Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | 8" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 321 | Disco KR15 |
| Cited variants | — |
|
| Specifications | ||
| OEM | Disco[2] | — |
| Model | 321[2] | — |
| Equipment type | Wafer Dicing Saw[2] | — |
| Facility context | Cleanroom Instrumentation[2] | — |
| Application area | Nano and Micro Fabrication[2] | — |
| Location | FNT 4.106[2] | — |
| Wafer Size | Up to 6 inches[3] | — |
| Spindle Power | 1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[4] | — |
| Spindle Power (alternate) | 1500 Watt spindle[3] | — |
| Non-Contact Setup | Non Contact Setup[4] | — |
| Microscope | Microscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[4] | — |
| Broken Blade Detection | Broken Blade Detection[4] | — |
| Light Tower | Includes Light Tower[4] | — |
| Chuck Type | 6" Universal Chuck (or 6" Porous Film Frame Chuck)[3] | — |
| Wafer size capability | Up to 6" wafers[4] | — |
| Chuck | 6-inch porous film frame chuck[3] | — |
| Spindle power | 1500-watt spindle[3] | — |
| Footprint | Small footprint[3] | — |
| Setup | Non-contact setup[4] | — |
| Blade break detection | Broken blade detection[4] | — |
| Other features | Floppy drive, light tower, blade tools, manuals[4] | — |
| Blade designation | — | Disco KR15[5] |
| Blade thickness | — | 200 micron[5] |
| Blade grit | — | low grit[5] |
| Intended materials | — | sapphire, glass, and silicon[5] |
| Max. workpiece size | — | Φ8"[5] |
| Thickness | — | 200 micron[5] |
| Grit | — | Low grit[5] |
| Materials | — | sapphire, glass, and silicon[5] |
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