Comparison ledger
EV Group 540, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 540EV Group | 10100West Bond |
|---|---|---|
| OEM | EV Group | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 540 | West Bond 10100 |
| Specifications | ||
| Configuration | Anodic bond, fusion bond, adhesive bond[1] | — |
| Wafer sizes | 6, 8 inch[1] | — |
| Maximum substrate size | 300 mm[2] | — |
| Bond force | up to 350 kN[2] | — |
| Bonding types | Anodic bond, fusion bond, adhesive bond[1] | — |
| Automation | Semi automatic (4 stations) / Fully automated single-chamber[3] | — |
| Bond tools included | (4x) 8" tools, (4x) 6" tools, (1x) 4" tool[1] | — |
| Maximum bond chambers | 1[2] | — |
| Compatible alignment systems | SmartView and MBA300[2] | — |
| Maximum heater size | 300 mm[2] | — |
| Loading chamber | 2-axis robot[2] | — |
| Max. bond chambers | 1[2] | — |
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