Comparison ledger
EV Group EVG 40 NT, SUSS MicroTec 150 e Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | EVG 40 NTEV Group | 150 e MaskSUSS MicroTec |
|---|---|---|
| OEM | EV Group | SUSS MicroTec |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | — | SUSS MicroTec 150 e Mask |
| Specifications | ||
| Manufacturer | EV Group[1] | — |
| Model | EVG 40 NT[1] | — |
| Product type | Aligner[1] | — |
| Vintage | 2011[1] | — |
| Measurement scope | Lithography-relevant parameters and bond alignment accuracy[2] | — |
| Measurement methods | Critical dimension measurement, die-to-die alignment verification, multi-layer thickness measurement[2] | — |
| Tool format | Stand-alone tool[2] | — |
| Integrated module | AVM (HVM-integrated module)[2] | — |
| Application examples | Nanoimprint lithography and wafer-to-wafer bonding[2] | — |
| Verification capability | 100 nm bond overlay accuracy of EVG's GEMINI FB automated fusion bonding system[2] | — |
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