Comparison ledger
Heller 1088, Tokyo Electron Formula, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1088Heller | FormulaTokyo Electron |
|---|---|---|
| OEM | Heller | Tokyo Electron |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Heller 1088 | Tokyo Electron Formula |
| Cited variants | — | |
| Specifications | ||
| Heating Zones | 8 zones (4 top and 4 below) plus 1 cooling zone[4] | — |
| Heating Method | Forced convection[4] | — |
| Conveyor Width | 18 inches (45 cm)[4] | — |
| Heated Length | 43.5 inches (111 cm)[4] | — |
| Overall Length | 96 inches (244 cm)[4] | — |
| Height | 50 inches (127 cm)[4] | — |
| Net Weight | 900 lbs (409 kg)[4] | — |
| Thermal Profiler | Included[4] | — |
| Oven Top | Counter balance for easy access to conveyor[4] | — |
| Solder Compatibility | Lead-free and leaded soldering[4] | — |
| Configuration | — | TEOS / HF / F2[1] |
| Wafer size | — | 12 inch[2] |
| Process chemistry | — | TEOS / HF / F2[1] |
| Vintage | — | 2002[2] |
| Wafer Size | — | 12 inch (300 mm)[1] |
| Process Chemistry (variant) | — | TEOS / HF / F2[1] |
| Vintage (listed unit) | — | 2002[1] |
| Process capabilities | — | TEOS, HF, F2, DCS, NH3, SiN[1] |
Plan your fab
Building a Thermal / Diffusion process? Get a complete equipment list.
Open the fab equipment planner →