Comparison ledger
Heller 1088, Tystar Mini Tytan 4600, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1088Heller | Mini Tytan 4600Tystar |
|---|---|---|
| OEM | Heller | Tystar |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | — | 50mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Heller 1088 | Tystar Mini Tytan 4600 |
| Specifications | ||
| Heating Zones | 8 zones (4 top and 4 below) plus 1 cooling zone[1] | — |
| Heating Method | Forced convection[1] | — |
| Conveyor Width | 18 inches (45 cm)[1] | — |
| Heated Length | 43.5 inches (111 cm)[1] | — |
| Overall Length | 96 inches (244 cm)[1] | — |
| Height | 50 inches (127 cm)[1] | — |
| Net Weight | 900 lbs (409 kg)[1] | — |
| Thermal Profiler | Included[1] | — |
| Oven Top | Counter balance for easy access to conveyor[1] | — |
| Solder Compatibility | Lead-free and leaded soldering[1] | — |
| Furnace stack tubes | — | Four vacuum tubes in one furnace stack[2] |
| Atmospheric pressure tubes | — | Two[2] |
| Low-pressure tubes | — | Two[2] |
| Maximum temperature for silicon nitride | — | Up to 850 °C[2] |
| Maximum temperature for all others | — | Up to 650 °C[2] |
| Maximum deposition thickness | — | 5 µm[2] |
| Low temperature oxidation | — | For processes of < 450 °C[2] |
| Mass flow system | — | MFS-460[2] |
| Data collection system | — | DCS-30[2] |
| Wafer Size | — | up to 150 mm (6 inch)[2] |
| Maximum Temperature (Silicon Nitride) | — | 850 °C[2] |
| Maximum Temperature (Other Processes) | — | 650 °C[2] |
| Low Temperature Oxidation Temperature | — | < 450 °C[2] |
| Number of Tubes | — | 4 (2 atmospheric, 2 low-pressure)[2] |
| LPCVD Processing Status | — | Currently not available[2] |
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