Waferpedia

Comparison ledger

1707versus0332 F 9453 302 Diffusion

Heller 1707, Varian 0332 F 9453 302 Diffusion, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1707Heller
OEMHellerVarian
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHeller 1707Varian 0332 F 9453 302 Diffusion
Cited variants—
Specifications
Oven Length3615 mm[1]—
Process Gas OptionsAir, Nitrogen[1]—
Heated Zones7[1]—
Heated Length (Convection/Total)1920[1]—
Cool Zones1[1]—
Max Working TemperatureStandard: 350°C; Option: 450°C[1]—
Maximum PCB Width55.9 cm (22"); optional 61 cm[1]—
Cleanroom OptionDown to Class 1000[1]—
Max Working Temperature (Standard)350°C[1]—
Max Working Temperature (Optional)450°C[1]—
Conveyor Speed (Maximum)188 cm/min (74 in/min)[3]—
Heater Wattage Per Zone (Typical)5400 W[3]—
Product typeReflow oven system[1]—
Cooling zones1[1]—
Maximum PCB width55.9 cm (22 in), 61 cm optional[1]—
Max working temperature350°C standard, 450°C option[1]—
Heated length1920 mm[1]—
Heated tunnel length190 cm[3]—
Overall dimensions340 x 137 x 160 cm[4]—
Maximum conveyor speed188 cm/min[4]—
Asset Number—142841[5]
Last Confirm Date—October 14, 2025[6]

Plan your fab

Building a Thermal / Diffusion process? Get a complete equipment list.

Open the fab equipment planner →
Sources (6)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]efsmt.comefsmt.com
  3. [3]efsmt.comefsmt.com
  4. [4]amtest-smt.comamtest-smt.com
  5. [5]Equipment inventory listing
  6. [6]fab-spares.comfab-spares.com