Comparison ledger
Hitachi 1305 BSG 3, YES 500, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1305 BSG 3Hitachi | 500YES |
|---|---|---|
| OEM | Hitachi | YES |
| Category | Wet Processing / Clean | Wet Processing / Clean |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Hitachi 1305 BSG 3 | YES 500 |
| Cited variants | — | |
| Specifications | ||
| System name | — | IL 500 AUTO In-Line Plasma System[1] |
| Loading | — | Robotically loaded[1] |
| Automation | — | Fully automatic[1] |
| Integration | — | Designed to integrate into any commercially available automated bonding system[1] |
| Protocol | — | SMEMA protocol[1] |
| Supported products | — | Lead frames, boats, or substrate/PCB products[1] |
| Clean handling feature | — | Special captive magazine (CLEANMAG) that is snap-loaded into a quick-change, self-aligning base assembly[1] |
| Contamination control | — | All moving parts and robotics are mounted external to the chamber[1] |
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