Comparison ledger
KLA Surfscan SP 2 Particle Defect, Sonoscan Gen-6, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Gen-6Sonoscan | |
|---|---|---|
| OEM | KLA | Sonoscan |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | 300mm | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | new generation |
| Family | KLA Surfscan | Sonoscan Gen-6 |
| Specifications | ||
| P/N | 0074965-000[1] | — |
| Configuration | Includes HDD[1] | — |
| Handler Type | Vacuum 300mm/200mm[2] | — |
| Defect sensitivity | <37 nm on polished bare silicon[1] | — |
| Technology nodes | 90, 65, & 45 nm[1] | — |
| Inspection modes | Standard Throughput Inspection Mode, High Sensitivity Inspection Mode[1] | — |
| Illumination | Oblique Illumination; DF (Oblique, Normal) ST and LT Mode[2] | — |
| Collection | Wide & Narrow[2] | — |
| Software version | 5.40[2] | — |
| Included licenses | Optical Filter, Enhanced XY Coordinates, 2 mm Edge Exclusion, Standard Classification Package, LPD-N Classification, LPD-ES Classification, Grading & Sorting, Haze, Haze Analysis & Normalization, Haze Line Classification, IDM 2011 Vintage[1] | — |
| Operating system | Microsoft Windows XP[1] | — |
| Wafer handler | 300 mm Phoenix Dual FIMS Vacuum Wafer Handler (PP) Ballroom Configuration; Phoenix 2.0 Handler[1] | — |
| Wafer size | Includes 300 mm Phoenix Dual FIMS Vacuum Wafer Handler (PP)[1] | — |
| Software vs | 5.40[2] | — |
| OEM | KLA[1] | — |
| Model | Surfscan SP 2[1] | — |
| Wafer Sizes | 12 inch[1] | — |
| Particle sensitivity | <37 nm defect sensitivity on polished bare silicon[1] | — |
| Illumination mode | Oblique illumination[1] | — |
| Included components | UV Laser; defect map & histogram with zoom; iMicroView measurement capability; SURFimage; Real-Time Defect Classification (RTDC); Microsoft Windows XP Operating System[1] | — |
| Handler | 300 mm Phoenix Dual FIMS Vacuum Wafer Handler (PP) Ballroom Configuration (Standard)[1] | — |
| Technology | — | PolyGate™ technology with Multi-Gate™ and Probing-Gate™ functions capable of single and multi-focus imaging[3] |
| Gates per channel | — | Up to 100 gates per channel[3] |
| Sampling rate | — | 2 Gsps[3] |
| Scanner | — | Inertially Balanced Linear Motor Scanner[3] |
| Scan reference platform | — | Tower-mounted scan reference platform and sample fixture[3] |
| Scanning area | — | Open-access scanning area[3] |
| Scan capacity | — | Capable of scanning JEDEC trays or a 300mm wafer[3] |
| Temperature control | — | Water recirculation and optional inline temperature control[3] |
| Analysis software | — | SonoSimulator for simplified analysis of stacked die parts[3] |
| Data analysis | — | Digital Image Analysis (DIA) quantifies acoustic data and supports automatic accept/reject criteria[3] |
| Rescanning | — | Virtual Rescanning Mode (VRM) stores comprehensive data for complete analysis after the sample is no longer available[3] |
| Instrument type | — | C-mode Scanning Acoustic Microscope[3] |
| Wafer size capability | — | 300mm wafer[3] |
| Control software operating system | — | Windows 7 Ultimate[3] |
| Scanner type | — | Inertially Balanced Linear Motor Scanner[3] |
| Cooling / fluid handling | — | Water recirculation and optional inline temperature control[3] |
| Software analysis tools | — | SonoSimulator, Digital Image Analysis (DIA), and Virtual Rescanning Mode (VRM)[3] |
| Optional imaging mode | — | Frequency Domain Imaging (FDI)[3] |
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