Waferpedia

Comparison ledger

SEZ 323 Spinversus100 ICP Fluorine

Lam Research SEZ 323 Spin, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
SEZ 323 SpinLam Research
100 ICP FluorineOxford Instruments
OEMLam ResearchOxford Instruments
CategoryEtchEtch
Wafer sizeSingle wafer—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLam Research SEZOxford Instruments 100 ICP Fluorine
Cited variants
  • Lam / SEZ 323 Spin Etcher[1]
  • 2002 Vintage[1]
  • 2005 Vintage[2]
  • 2006 Vintage[3]
—
Specifications
ConfigurationChambers (2)[4]—
Wafer Sizes8, 12 inch[4]—
Chambers2[4]—
Wafer sizes8 inch, 12 inch[4]—
Number of chambers2[4]—
OEMLam / SEZ[4]—
Model323[4]—
Tool typeSpin Etcher[4]—
Voltage400 VAC[2]—
Phase3 Phase[2]—
Max. Current75 A[2]—
Wafer sizeSingle wafer[2]4 inch, 6 inch, 8 inch (with clamp change)[5]
Etch Gases—SF6, CF4, O2, Ar, N2, CHF3, C4F8[5]
Cryo DRIE etch rate—up to 5 µm/min[5]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]inventory listing
  5. [5]nanofab.utah.edunanofab.utah.edu