Comparison ledger
Lapmaster 12 Benchtop Lapping Polishing, Strasbaugh 6 EC, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 12 Benchtop Lapping PolishingLapmaster | 6 ECStrasbaugh |
|---|---|---|
| OEM | Lapmaster | Strasbaugh |
| Category | CMP | CMP |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lapmaster 12 Benchtop Lapping Polishing | Strasbaugh 6 EC |
| Specifications | ||
| Make | Lapmaster[1] | — |
| Model | 12[1] | — |
| Category | CMP[2] | — |
| Type/Application | Single sided[3] | — |
| Plate diameter | 12 in[3] | — |
| No. of conditioning rings | 3[4] | — |
| Configuration | Ring lapper[4] | 50/60 Hz[6] |
| Base | Rigid, lightweight, cast aluminum base[4] | — |
| Standard RPM | 60 RPM[4] | — |
| RPM range with variable speed drive | 0-60[4] | — |
| Drive motor - lapper | 0.5 HP[4] | — |
| Drive motor - polisher | 0.75 HP[4] | — |
| Length | 25 in[4] | — |
| Width | 18 in[4] | — |
| Height | 24 in[4] | — |
| Estimated shipping weight | 240 lbs[4] | — |
| Approximate weight | 135 lbs / 61 kg[5] | — |
| Approximate dimensions | 24.5 in × 17.5 in × 23.8 in (622 mm × 445 mm × 607 mm)[5] | — |
| Electrical system | Various voltages; 50/60 Hz; 1 phase and 3 phase to customer specification[5] | — |
| Motor | 1/3 hp / 0.25 kW motor with gear reducer[5] | — |
| Abrasive feed system | Designed for water or oil based lapping slurries[5] | — |
| Automatic cycle timer | Automatic digital cycle timer[5] | — |
| Ring configuration | Ring lapper[4] | — |
| Ring ID | 4.25 inches[4] | — |
| Phase | — | 3 Phase[6] |
| Voltage | — | 208 V[6] |
| Full Load | — | 30 A[6] |
| Wafer size (inch) | — | 3, 4[7] |
| Wafer size (mm) | — | 100[8] |
| Input voltage | — | 208 V[6] |
| Frequency | — | 50/60 Hz[6] |
| Full load current | — | 30 A[6] |
| Motor amps | — | 13.6 A[6] |
| Conditioning arm sweep zones | — | 10[9] |
| Pad conditioning zones | — | 20[10] |
| Control interface | — | Color touch-screen GUI[10] |
| Carrier type | — | ViPRR[10] |
| Load station | — | Hydro-Lift[10] |
| Table and spindle motor control | — | Closed-loop RPM[10] |
| Pad conditioning type | — | In-situ and ex-situ[10] |
| Typical applications | — | Si and SiO2 polishing and planarizing[8] |
| Asset / model | — | Strasbaugh 6 EC[6] |
| Power | — | 50/60 Hz, 3 phase, 208 V[6] |
| Motor current | — | 13.6 motor amps[6] |
| Wafer size | — | 100 mm[8] |
| Substrate chucks | — | 3-inch and 4-inch wafers[7] |
| Functions | — | Si and SiO2 polishing and planarizing[8] |
| Programmable controls | — | fully programmable sweep, downpressure, table speed, time, slurry flow[7] |