Waferpedia

Comparison ledger

1 WBS 1 Wafer Substrateversus505

Logitech 1 WBS 1 Wafer Substrate, MRSI 505, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
505MRSI
OEMLogitechMRSI
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLogitech 1 WBS 1 Wafer SubstrateMRSI 505
Specifications
Wafer Size6 inch[1]—
X-Y Resolution—0.5 micron[2]
Platform Material—Solid Granite Overhead and Base Platform[2]
X-Y Axis Motors—Two Linear Anarad DC Motors with Glass Encoders[2]
Z Axis Motor—One Brushless Ball Screw Drive Motor[2]
Camera System—Three Dual Magnification IR Cameras with Programmable Lighting; Look-up Camera for Flip Chip[2]
Inspection Station—Bottom mounted camera[2]
Controller—Rack Mount Industrial Computer[2]
Vacuum System—Vacuum Surface Pick Up Valves, Meter & Tubing[2]
Work Surface—Large work surface accommodates most input and output options[2]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]gtsaz.comgtsaz.com