Comparison ledger
Logitech 1 WBS 1 Wafer Substrate, West Bond 7367E, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1 WBS 1 Wafer SubstrateLogitech | 7367EWest Bond |
|---|---|---|
| OEM | Logitech | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Logitech 1 WBS 1 Wafer Substrate | West Bond 7367E |
| Specifications | ||
| Wafer Size | 6 inch[1] | — |
| Model | — | 7367E[2] |
| Series | — | 7372E · 7367E · 7374E Series[2] |
| Type | — | Manual Die Bonder[2] |
| Configuration | — | Dual-head[2] |
| Construction | — | Gantry construction[2] |
| Motion | — | Orthogonal motions rather than pivoted[2] |
| Axis brakes | — | Individual axis brakes[2] |
| ESD protection | — | Included[2] |
| Head operation | — | Heads used alternately to pick up chips, then rotate, place, and bond them[2] |
| Head configuration | — | Detachable heads[2] |
| Manipulator | — | Three-axis micromanipulator[2] |
| Workpiece handling | — | All machine mechanism arrayed above the work plane[2] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →