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Comparison ledger

NSR-2205i11Dversus150 e Mask

Nikon NSR-2205i11D, SUSS MicroTec 150 e Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
150 e MaskSUSS MicroTec
OEMNikonSUSS MicroTec
CategoryLithographyLithography
Wafer size——
Process node0.35 micron—
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyNikon NSR-2205i11DSUSS MicroTec 150 e Mask
Specifications
Tool typeStep-and-Repeat System[1]—
Process node0.35 micron[1]—
Node0.35 micron[1]—
Technology Node0.35 micron[1]—
TypeStep-and-repeat system[1]—
Resolution node0.35 micron[1]—
Machine typeStep-and-Repeat System[1]—
Target design node0.35 micron[1]—
System typeStep-and-repeat system[1]—
Target node0.35 micron[1]—
Design node0.35 micron[1]—
Node (resolution)0.35 micron[1]—
Resolution0.35 micron[1]—
Minimum feature size0.35 μm[1]—
Design Rule0.35 micron[1]—
Feature Size0.35 micron[1]—
DescriptionState-of-the-art workhorse[1]—
Equipment typeStep-and-repeat system[1]—

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Sources (1)Every fact above is drawn from these public sources
  1. [1]chiphistory.orgchiphistory.org