Comparison ledger
OAI 808-Aligner-Tool-Procedu, Tokyo Electron CleanTrack ACT 8, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | CleanTrack ACT 8Tokyo Electron | |
|---|---|---|
| OEM | OAI | Tokyo Electron |
| Category | Lithography | Lithography |
| Wafer size | 100mm | 100mm |
| Process node | — | DUV lithography |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | OAI 808-Aligner-Tool-Procedu | Tokyo Electron CleanTrack ACT 8 |
| Specifications | ||
| Model | OAI Model 800 Mask Aligner[1] | — |
| Automation | Semi-automated[1] | — |
| Camera count | Four-camera[1] | — |
| Alignment type | Optical front- and backside mask aligner[1] | — |
| Alignment accuracy | 1 µm to 2 µm[1] | — |
| Backside focus | Motorized[1] | — |
| Auto leveling | Motorized[1] | — |
| Gap setting | Auto gap setting[1] | — |
| Supported piece size | 2", 100mm, 150mm, 200mm, pieces[1] | — |
| Thickness range | 0.1–10 mm[1] | — |
| Mask size | 4"x4"; 5"x5"; 7"x7"; 9"x9"[1] | — |
| Top side alignment | ± 1.0 µm 3σ[1] | — |
| Bottom side alignment | ± 1.25 µm 3σ[1] | — |
| Large gap alignment | Option / ± 1.5 µm 3σ[1] | — |
| Resolution | Vacuum + Hard Contact ≤ 1 µm; Hard Contact ≤ 1.5 µm; Soft Contact ≤ 2.0 µm; Proximity ≥ 3.0 µm[1] | — |
| Exposure wavelength | 350–450 nm[1] | — |
| Lamp | Mercury arc lamp, 350 W[1] | — |
| Type | semi-automated, four-camera, optical front- and backside mask aligner[1] | — |
| Motorized backside focus | yes[1] | — |
| Motorized auto leveling | yes[1] | — |
| Auto gap setting | yes[1] | — |
| Size | 2 in, 100 mm, 150 mm, 200 mm[1] | — |
| Thickness | 0.1-10 mm[1] | — |
| Mercury arc lamp | 350 W[1] | — |
| Equipment type | — | Industry-standard wafer coater and developer[2] |
| Lithography mode | — | DUV lithography[2] |
| Exposure interface | — | In-line exposure unit interface[2] |
| Throughput / footprint | — | High throughput in a small footprint[2] |
| Cluster configuration | — | Coater and developer track in-line with an ASML PAS5500/350C stepper[2] |
| Configured wafer size | — | 100 mm (4") wafers[2] |
| Convertible wafer size | — | 150 mm (6") wafers[2] |
| Process materials | — | KrF photoresist and ancillary anti-reflective coatings[2] |
| Track blocks | — | Carrier Station Block (CSB), Process Block (PRB), Interface Block (IFB)[2] |
| Wafer size | — | 100 mm (4 inch) standard, convertible to 150 mm (6 inch) on demand[2] |
| Lithography type | — | DUV (KrF)[2] |
| In-line stepper interface | — | ASML PAS5500/350C[2] |
| Cassette ports | — | Four (two for 100 mm, two for 150 mm)[2] |
| Resist pump lines | — | 4 for photoresist (COT), 2 for BARC (BCT)[2] |
| Developer lines | — | 2 pressure-driven lines[2] |
| BARC materials supported | — | DS-K101 (Brewer Science), DUV-42P[2] |
| Photoresists supported | — | M108Y (JSR Corporation, 0.18 μm), M35G (0.25 μm)[2] |
| Developer used | — | TMA238WA[2] |
| Solvent used | — | Microposit EC Solvent (Dupont)[2] |
| Temperature/humidity control | — | Internal laminar flow with regulated temperature, humidity, and cup temperature/humidity controller (T&H)[2] |
| Water Flow | — | Left to Right[3] |
| Software Version | — | 1.18.003[4] |
| CIM | — | SECS[4] |
| Handler System | — | CRA, PRA (2)[4] |
| Factory Interface | — | SMIF (3)[4] |
| Coater/Developer | — | Wafer coater and developer[2] |
| Configuration | — | In-line with ASML PAS5500/350C stepper forming a DUV lithography cluster[2] |
| Wafer Size (Configured) | — | 100 mm (4")[2] |
| Wafer Size (Conversion Possible) | — | 150 mm (6") - rare and on-demand[2] |
| Main Blocks | — | Carrier Station Block (CSB), Process Block (PRB), Interface Block (IFB)[2] |
| Spinning Units | — | Bottom-layer Coater (BCT), Coater (COT), Developer (DEV)[2] |
| Thermal Plates | — | Low-temperature Hot Plate, High-temperature Hot Plate, High-speed Chill Plate, ADHesion plates, Precision Hot Plates, Transition Station, Transition Chill Plate[2] |
| Interface Buffer | — | 25-slot buffer[2] |
| Photoresist | — | KrF photoresist (M108Y, M35G)[2] |
| BARC | — | DS-K101 and DUV-42P[2] |
| Developer | — | TMA238WA[2] |
| External Modules | — | AC Power Box, Chemical Cabinet, Temperature and Humidity Controller, Thermostatic Water Supply[2] |
| In-line exposure unit | — | ASML PAS5500/350C[2] |
| Wafer capacity (cassette ports) | — | 4[2] |
| BARC types | — | DS-K101 (Brewer Science) and DUV42P[2] |
| Photoresist types | — | M108Y (JSR Corporation) and M35G[2] |
| Exposure unit interface | — | in-line exposure unit interface[2] |
| Chemical filters | — | ULPA chemical filters[2] |
| Ovens | — | high-precision ovens[2] |
| Conversion wafer size | — | 150 mm (6") wafers[2] |
| Photoresist chemistry | — | KrF photoresist[2] |
| Ancillary coating | — | AntiReflective Coatings[2] |
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