Comparison ledger
Onto Innovation NSX 330, Onto Innovation NSX 330 B, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | NSX 330Onto Innovation | NSX 330 BOnto Innovation |
|---|---|---|
| OEM | Onto Innovation | Onto Innovation |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | Supports non-standard wafer types (Mems, Taiko, Thin) | Three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Onto Innovation NSX 330 | Onto Innovation NSX 330 |
| Specifications | ||
| Voltage Range | 208-240 VAC[1] | — |
| Configuration | Single Phase, GND[1] | Programmable light tower[4] |
| Rate Full Load Current | 12.75 Amps[1] | — |
| Rating of Largest Motor or Load | 5 Amps[1] | — |
| Wafer size | Supports non-standard wafer types (Mems, Taiko, Thin)[2] | Three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer[4] |
| Full load current | 12.75 Amps[3] | — |
| Maximum pneumatic working pressure | 110 PSI[3] | — |
| Category | Metrology & Inspection[2] | Metrology & Inspection[5] |
| Phase | Single Phase[1] | — |
| Frequency | 50/60 Hz[1] | — |
| Largest motor or load rating | 5 Amps[1] | — |
| Camera configurations | Supports up to 6 camera configurations[2] | — |
| Imaging platform | 2D based image recognition platform with programmable lighting[2] | — |
| Stage | Programmable motorized stage[2] | — |
| Functions | Provides defect analysis and classification[2] | — |
| Resolution | 10μm to 0.5μm[1] | — |
| Review station | Supports navigation, display, annotation, classification review[1] | — |
| Defect review platform | Full-scale defect review platform for quick classification[1] | — |
| Special wafer handling | Supports large warpage (>12mm) and ultra-thin wafers (<50μm)[1] | — |
| HDD | HDD not included[1] | — |
| Pneumatic working pressure | 110 PSI[2] | — |
| Optics | Supports up to 6 camera configurations[2] | Programmable illumination filter wheel[5] |
| Software | NSX software supports storage and retrieval of metrology results[2] | — |
| Client software | Provides T defect review client[1] | — |
| Wafer handling | With lens, robot, controller[2] | — |
| Wafer types | Supports non-standard wafer types (Mems, Taiko, Thin)[2] | — |
| Inspection type | Inspection system[2] | — |
| Resolution options | 10μm to 0.5μm[2] | — |
| Power | 208-240 VAC[1] | — |
| Included items | With lens, robot, controller[1] | — |
| Review functions | Navigation, display, annotation, classification review[2] | — |
| Off-line review | Built-in review station supports off-line review[2] | — |
| Inspection modes | — | Three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer[5] |
| Resolution flexibility | — | 10µm to 0.5µm[4] |
| Illumination | — | Programmable light tower; multiple modes of dark field illumination[4] |
| Control/software | — | Recipe sharing; recipe server; Discover® Software database results archiving[5] |
| Options | — | Teams with edge and backside modules for all-surface solution[4] |
| Handling | — | Unique handling solutions (Mems, Taiko, Thin), extreme warpage (>12mm) and ultra-thin (<50µm)[4] |
| Objective turret | — | Five available slots; compatible with 1X, 2X, 3X, 5X, 10X, 20X, and 50X objectives[4] |
| Tool matching | — | Supported[4] |
| Vintage | — | 2017[4] |
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