Comparison ledger
Oxford Instruments 100 ICP Fluorine, Oxford Instruments Plasmalab 800 Plus RIE, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100 ICP FluorineOxford Instruments | Plasmalab 800 Plus RIEOxford Instruments |
|---|---|---|
| OEM | Oxford Instruments | Oxford Instruments |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Oxford Instruments 100 ICP Fluorine | Oxford Instruments Plasmalab 800 |
| Specifications | ||
| Etch Gases | SF6, CF4, O2, Ar, N2, CHF3, C4F8[1] | — |
| Cryo DRIE etch rate | up to 5 µm/min[1] | — |
| Wafer size | 4 inch, 6 inch, 8 inch (with clamp change)[1] | — |
| Configuration | — | LEP Tungsten[2] |
| Type | — | Reactive Ion Etching (RIE) System[3] |
| Controller | — | PC controller[4] |
| Footprint design | — | All electronics and vacuum components located within the tool body to minimize footprint[4] |
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