Comparison ledger
Oxford Instruments 100 ICP Fluorine, Ulvac NE 950 ICP-RIE, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100 ICP FluorineOxford Instruments | NE 950 ICP-RIEUlvac |
|---|---|---|
| OEM | Oxford Instruments | Ulvac |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Oxford Instruments 100 ICP Fluorine | Ulvac NE 950 |
| Specifications | ||
| Etch Gases | SF6, CF4, O2, Ar, N2, CHF3, C4F8[1] | — |
| Cryo DRIE etch rate | up to 5 µm/min[1] | — |
| Wafer size | 4 inch, 6 inch, 8 inch (with clamp change)[1] | 2" to 12" wafers[2] |
| Configuration | — | Gas Box:[2] |
| Gas 1 Horiba STEC SEC-E40 Ar | — | 100SCCM[2] |
| Gas 2 Horiba STEC SEC-E40 O2 | — | 100SCCM[2] |
| Gas 3 Horiba STEC SEC-E40 CHF3 | — | 100SCCM[2] |
| Cooling Gas | — | MKS 649A 50SCCM[2] |
| Match Box 1 | — | AMV-1000-12.5M-CT[2] |
| Match Box 2 | — | AMV-1000-AV3[2] |
| Valve | — | MKS T3PIA 26696[2] |
| Gauge | — | MKS E28D[2] |
| Process type | — | ICP-RIE (Inductively Coupled Plasma - Reactive Ion Etch)[2] |
| Chuck | — | φ 305mm (φ2’ φ4’ φ6’ φ8’)[2] |
| RF Generator 1 | — | AX-1000 (AD-TEC)[2] |
| RF Generator 2 | — | AX-1000 (AD-TEC)[2] |
| Gas 1 | — | Horiba STEC SEC-E40 Ar: 100SCCM[2] |
| Gas 2 | — | Horiba STEC SEC-E40 O2: 100SCCM[2] |
| Gas 3 | — | Horiba STEC SEC-E40 CHF3: 100SCCM[2] |
| Gas 4 | — | Horiba STEC SEC-E440J BCL3: 200SCCM[2] |
| Gas 5 | — | Horiba STEC SEC-E440J CL2: 200SCCM[2] |
| Gas 6 | — | Horiba STEC SEC-E440J SiCL4: 200SCCM[2] |
| Pressure valve | — | MKS T3PIA 26696[2] |
| Turbo pump | — | Shimadzu E1-D2203MT / TMP-2203LMTG[2] |
| Dry pump | — | Ulvac HR60[2] |
Plan your fab
Building a Etch process? Get a complete equipment list.
Open the fab equipment planner →