Comparison ledger
Palomar 9000, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 9000Palomar | 10100West Bond |
|---|---|---|
| OEM | Palomar | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Palomar 9000 | West Bond 10100 |
| Specifications | ||
| Machine type | High-speed fine wire wedge and ribbon bonder[1] | — |
| Bond head drive technology | Voice coil technology[1] | — |
| Wedge clamps | Interchangeable 45-60° and 90° deep access wedge clamps[1] | — |
| Work area | 304 x 152 mm[1] | — |
| Bond head motion note | The entire bond head mechanism rides on theta[1] | — |
| Bond head technology | Voice coil technology[1] | — |
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