Waferpedia

Comparison ledger

Raider ECD 312 ElectroplatingversusRaider ECD Electroplating

Semitool Raider ECD 312 Electroplating, Semitool Raider ECD Electroplating, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMSemitoolSemitool
CategoryLab & Support EquipmentDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilySemitool Raider ECDSemitool Raider ECD
Specifications
Phase3 Phase[1]3 Phase[2]
Configuration50/60 Hz[1]5 Wire[2]
Voltage380 V[1]208 V[2]
Loadport3 X FOUP[1]—
PCFUI[1]—
Power Phase3 Phase[1]—
Frequency50/60 Hz[1]—
Wafer Handling RobotXfer Robot, 1x Linear Dual Arm with Edge Grip Endeffector[1]—
Vacuum and RinseVacuum prewet, 1 Stack SRD[1]—
Chemical Tanks11[1]—
Chillers4[1]—
ControllerPC with FUI[1]—
Chamber ComponentsChamber lift assy, Spin motor, Push plate control board, Plate sylinder (2), Contact Ring (only ECD), Lip seal (only eCD), Flow pump (only eCD), Anode basket (only eCD)[1]—
Tank ComponentsTank body, Circulation pump, Filter housing, Heater housing, Level sensor (5), Tank remote board, Tank control block[1]—
Vintage2011[1]—
Wafer size—300 mm[3]
Electrical specification—3 Phase, 208 V, 5 Wire, 50/60 Hz, 125 amp[2]

Plan your fab

Building a Lab & Support Equipment process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]fabsurplus.comfabsurplus.com