Applied Materials P 5000 Mark II

Models in this family

1. 

   P 5000 Mark IIintroduced 1991

   The Applied Materials P 5000 Mark II is a plasma-enhanced chemical vapor deposition (PECVD) system designed for semiconductor wafer processing.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   P 5000 Mark II PECVD, 8" DxZ	—	—	—	Equipment inventory listing[1]
   P 5000 Mark II PECVD, 8" DxL	—	—	—	Equipment inventory listing[2]
   P 5000 Mark II PECVD, 8"	—	1991	Software: b6.02; 1991 Vintage.	Equipment inventory listing[3]
   P 5000 Mark II PECVD, 6"	—	2010	Described as refurbished; includes a Wafer Orienter, Phase 3 Robot, Phase 3 Cassette Handler, and other listed hardware/options.	Equipment inventory listing[4]
   P 5000 Mark II (1991 vintage)	—	1991	Software b6.02, 8 inch	Equipment inventory listing[3]
   P 5000 Mark II (2010 vintage)	—	2010	6 inch, refurbished, Silane PECVD, wafer orienter, Phase 3 robot, Phase 3 cassette handler, bolt down lid, storage elevator 29 slots, expanded 21 slot VME, 3.5 inch floppy drive, mini controller, CES gas panel, RF generator rack, remote frame with AC box, load lock pump Edwards iH 80 Series, Applied Materials heat exchanger, no CE mark, no electrostatic chuck, no independent backside He cool, no VDS, no signal lamp tower, no bolt on SMIF, no standalone endpoint system, chamber positions A/B/C Silane DCVD, position D empty, lid type bolddown, RF match Phase IV, endpoint standard, cathode type susceptor, lid gas distribution GDP, no chamber liner, no autobias, no slit liner door, gas lines: N2 3000 sccm, He 5000 sccm, N2O 3000 sccm, NH3 200 sccm, 2% SiH4/Bal He 5000 sccm, CF4 1600 sccm, N2O 50 sccm	Equipment inventory listing[4]
   P 5000 Mark II (CVD variant)	—	—	8 inch, 208VAC 50/60Hz, dual SATA RAID hard drive, compact flash floppy emulator, flat screen monitors x2, 8 slot storage elevator, Phase III robot, AMAT 0 heat exchanger, remote AC frame with two ENI OEM 12 13.56MHz generators, 12 slot gas panel, chamber A Silane SiO2 PECVD, chamber B Silane SiN PECVD	Equipment inventory listing[5]

2. P 5000 Mark II BPTEOS
3. 

   P 5000 Mark II CVD-PVD

   The Applied Materials P 5000 Mark II CVD-PVD is a semiconductor deposition system that combines chemical vapor deposition and physical vapor deposition.

4. P 5000 Mark II Dielectric

   The Applied Materials P 5000 Mark II Dielectric is a plasma etch system designed for etching dielectric materials in semiconductor manufacturing.

5. 

   P 5000 Mark II DLH

   The Applied Materials P 5000 Mark II DLH is a plasma-enhanced chemical vapor deposition (PECVD) system for 6-inch wafers.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   P 5000 Mark II DLH Delta	—	—	—	waferpedia.com[6]

6. 

   P 5000 Mark II J

   The Applied Materials P 5000 Mark II J is a chemical vapor deposition (CVD) system used for thin-film deposition.

Sources