Tool family
Esec Datacon 2200 evo hS
The Esec Datacon 2200 evo hS is a die bonder for epoxy die attach applications. The Esec Datacon 2200 evo hS is a 300 mm high-speed platform with real-time process monitoring and a bonding accuracy of 20 µm at 3σ.
Models in this family
- Datacon 2200 evo hS3rd generation
The Esec Datacon 2200 evo hS is a die bonder for epoxy die attach applications. The Esec Datacon 2200 evo hS is a 300 mm high-speed platform with real-time process monitoring and a bonding accuracy of 20 µm at 3σ.
