Tool family
The Esec Datacon 8800 CHAMEO advanced is a hybrid bonding platform in the packaging and bonding category. The Esec Datacon 8800 CHAMEO advanced is listed alongside the Datacon 8800 FC QUANTUM advanced and Datacon 8800 FC QUANTUM advX in the hybrid bonding product area.
The Datacon 8800 CHAMEO advanced is a flip chip bonder for wafer-level fan-out packaging and related chip-attach applications.