Tool family
The Esec 2100 hS i is a die bonder for epoxy die attach applications. The Esec 2100 hS i is described as a 3rd generation 300 mm high speed platform.
The Esec 2100 hS i is a die bonder for epoxy die attach applications. The Esec 2100 hS i is described as a 3rd generation 300 mm high speed platform.