Waferpedia

Tool family

SUSS MicroTec SB6 / 8 Gen2

SUSS MicroTecPackaging & Bonding1 entry

The SUSS MicroTec SB6 / 8 Gen2 is a semi-automated wafer bonding system capable of handling wafers up to 200 mm.

LinkedIn X Email

Models in this family

  1. SB6 / 8 Gen2Gen2

    The SUSS MicroTec SB6 / 8 Gen2 is a semi-automated wafer bonding system capable of handling wafers up to 200 mm.