ASM

ASM XP8 is a registered trademark in ASM's product portfolio.

The ASM AS 899 is a test and sort machine.

The ASM Eagle AERO is an automatic ball wire bonding machine for high-end IC packaging, utilizing X-Power thermosonic bonding technology and capable of 22 µm bonded ball size.

The ASM DS 500 IL is a semiconductor dispenser manufactured by ASM.

The ASM AD 896 M is a die bonder.

The ASM E 2000 Plus EPI Reactor is used for epitaxial silicon deposition.

The ASM AB 339 Gold is a wire bonder described as a gold wire bonder.

The ASM E 2000 EPI Reactor is an epitaxial silicon deposition system for 6-inch wafers.

The ASM AD 896 is an automatic die bonder introduced in 2004.

The ASM Peva 900 E is a planetary wafer system with a 4-crucible turret.

The ASM Eagle 10 Trident is a plasma-enhanced chemical vapor deposition (PECVD) system.

The ASM Eagle XP 8 is a 300mm plasma-enhanced atomic layer deposition (PEALD) tool for dielectric film deposition.

The ASM E 2 / E 2000 ATM RH is a semiconductor equipment model for processing 6-inch wafers.

The ASM E 2000 is a radiantly heated, single-wafer epitaxial reactor for chemical vapor deposition of doped or undoped silicon layers on wafers up to 200 mm (8 inches).

The ASM iHawk Xtreme is an automatic wire bonder used in semiconductor packaging, supporting gold, copper, and alloy wires with capabilities including ultra-low loop control and automatic wire rethreading.

The ASM Eagle XP 8 DCM is a semiconductor equipment model manufactured by ASM, as recorded in an equipment inventory listing.

The ASM AD 898 is an automatic die bonder manufactured by ASM.

The ASM WS 896 LED is a wafer sorter designed for 4-inch wafers.

The ASM Eagle 60 is a gold wire bonder launched in 2002.

The ASM AD 8912 is a die bonder.

The ASM Eagle 60 AP is a wire bonder.

The ASM Siplace D Series is an SMT pick-and-place platform with single- to four-gantry configurations and Collect & Place or Pick & Place head options.

The ASM SIPLACE TX Series is a compact high-speed SMT placement platform for medium- and high-volume electronics production.

The ASM Eagle 12 is a deposition system used for chemical vapor deposition (CVD) and plasma-enhanced atomic layer deposition (PEALD).

The ASM Eagle 10 PETEOS is a semiconductor processing tool for 8 inch wafers, with a vintage of 1999.

The ASM AD 830 is a die bonder.

The ASM Harrier is a wire bonder used in semiconductor packaging.

The ASM Epsilon 3200 Epitaxial Reactor is a deposition system manufactured by ASM used for epitaxial growth.

The ASM Dragon 2300 is a plasma-enhanced chemical vapor deposition (PECVD) system for thin film deposition.

The ASM A 412 Diffusion is a thermal diffusion furnace.

The ASM AD 830 UR is a die bonder used in semiconductor packaging and bonding.

The ASM MS 100 is a manual die attacher designed to attach die onto the surface of electrical components or printed circuit boards.

The ASM AD 898 is a die bonder used in semiconductor packaging and bonding.

The ASM MP 209 Trim n Form is a semiconductor equipment model manufactured by ASM.

ASM AD 838 L G 2 is a die bonder with support for 6-inch and 8-inch wafer sizes.

ASM Integrated Circuit Diffusion is a thermal diffusion tool in the Thermal / Diffusion category.

ASM Siplace CA 4 Wafer is an 8-inch wafer system described as a high-volume chip assembly and 4-portal microchip/SMD hybrid assembly system.

ASM Eagle is a PECVD (plasma-enhanced chemical vapor deposition) system described as a 2-chamber unit with SiH4, N2O, and C3F8 gases.

The ASM AD 809 is a die bonder manufactured by ASM and categorized as Packaging & Bonding equipment, configured for 6-inch wafers.

The ASM A 412 Dual Reactor is a semiconductor processing tool used for deposition of nitride or doped polysilicon.

The ASM MS 899 DL is a die sorter.