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Manufacturer

Datacon

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2 entries

  1. 2200Datacon

    Datacon 2200 apm is a multi chip die bonder described as the current industry standard and based on Datacon's previous PPS 2200 Multi Chip Die Bonder platform.

    CategoryPackaging & Bonding
  2. 8800Datacon

    Datacon 8800 FC Smart Line RFID is a reel-to-reel RFID chip attach equipment solution for direct and indirect chip attach, built around the 8800 FC Quantum flip chip bonder.

    CategoryRFID chip attach equipment