Besi
2100 FC
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Besi Esec 2100 FC hS is a flip chip die bonder and the 3rd generation of the high speed FC platform from Besi. The Esec 2100 FC hS achieves a bonding accuracy of 8 µm at 3 sigma and a maximum throughput of 16,000 UPH. The Esec 2100 FC hS supports wafer sizes from 4 to 12 inches.[1][2]
What it is
How it works
The Esec 2100 FC hS uses flip chip bonding and reports a bonding accuracy of 8 µm in high accuracy mode. The machine also reports a minimum cycle time of 240 ms including dip fluxing.[1]
The Esec 2100 FC hS uses real time process monitoring with live images of the process zone. The machine also uses status control with wafer, strip, and magazine viewers, plus teaching and setup wizards for changeover and verification.[1]
Where it fits in the process flow
The Esec 2100 FC hS supports wafer sizes from 4 inches to 12 inches, frame sizes of 6 inches, 8 inches, and 12 inches, and strip dimensions up to 500 mm by 125 mm. The machine is also offered with substrate handler, strip handler, magazine handler, and related input and output options.[1]
Applications
The Esec 2100 FC hS is intended for flip chip applications including FCOL, FC-MIS, FC-SIP, FCCSP, FCBGA, and CSP-LED. The machine is also positioned for high speed production use.[1]
The machine supports die sizes from 0.2 mm to 20 mm and die thickness at or above 0.05 mm. The machine also reports use with wafer sizes from 4 inches to 12 inches.[1][2]
What do the numbers mean?
Wafer handling3
Performance1
Dimensions & facilities4
Configuration & options7
Observed configurations
How individual machines were equipped when they appeared on the secondary market — as listed, per unit. These describe one specific machine, not the model in general.
Unit as listed[3]
- 8"
- Track width: 125mm
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Esec 2100 FC plus | — | — | Bonding accuracy down to 10 µm (3σ); min. cycle time 400 ms; die size 0.5 … 20 mm; die thickness ≥ 0.1 mm. | micro-power.com.hk[4] |
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 2100 FC are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2100 FC are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 2100 FC are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2100 FC are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2100 FC is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 2100 FC are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]besi.com — besi.combesi.com
- [2]semiconductor.directory — semiconductor.directorysemiconductor.directory
- [3]Inventory photo
- [4]micro-power.com.hk — micro-power.com.hkmicro-power.com.hk
Last updated Sep 23, 2026.
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