Canon
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The Canon Heatpulse 8800 RTA is a rapid thermal anneal system that processes 8-inch (200 mm) wafers. The equipment is capable of rapid thermal processing, rapid thermal oxidation, and rapid thermal nitridation. The model was originally designed by Ag Associates and later marketed under the Canon brand.[1][3]
Primary applications include dopant activation for source/drain and gate regions, silicide formation (such as titanium or cobalt salicide), and thin oxide growth for gate dielectrics or tunnel oxides. The system can also perform rapid thermal nitridation for gate dielectric nitridation and rapid thermal annealing for memory device fabrication.
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The Heatpulse 8800 supports 8-inch (200 mm) wafers.[1]
The following facts about the Heatpulse 8800 RTA are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the Heatpulse 8800 RTA are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Heatpulse 8800 RTA are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Heatpulse 8800 RTA are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Heatpulse 8800 RTA are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Heatpulse 8800 RTA are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Last updated Sep 27, 2026.
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