CEE
100 CB Spin
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedSpin coaters of this class apply a liquid photoresist or other coating to the center of a substrate, then spin the substrate at high speed to spread the material into a uniform thin film by centrifugal force.
Where it fits in the process flow
General reference — not yet source-verifiedThe CEE 100 CB Spin operates in the deposition stage of semiconductor and microelectronics fabrication, used to create thin polymer or resist layers on substrates.
Spin coating and the subsequent hot plate bake typically precede photolithography, since the uniform resist film is the base layer on which circuit patterns are defined.
Applications
General reference — not yet source-verifiedSpin coater hot plates of this kind are commonly used in semiconductor fabrication, micro-electromechanical systems (MEMS) production, and other thin-film coating processes.
The tool is suited for applying photoresist, polyimide, or other spin-on materials that require a controlled bake after coating.
What do the numbers mean?
Configuration & options2
- With brake plates[1]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| CEE 100 CB Spin Coater Hot Plate | — | — | Includes a hot plate and a flow controller | waferpedia.com[3] |
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 100 CB Spin are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the 100 CB Spin are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 100 CB Spin are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 100 CB Spin are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 100 CB Spin are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 100 CB Spin is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]100 CB Spin — CEE | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
- [3]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Sep 22, 2026.
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