CEE
200 Bake Plate
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
The CEE 200 is a bake plate designed for thermal processing of substrates in semiconductor photolithography. The CEE 200 handles wafers up to 200 mm in diameter. The CEE 200 runs on an internal operating system and requires a 208 V power supply. The CEE 200 is part of a spin-coating workstation that includes spin coaters, an HMDS vapor primer, and a cooling station.[1][2][3]
What do the numbers mean?
Power & electrical1
Vacuum & pumping1
Wafer handling2
Control & software2
Configuration & options2
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
- CEE X-Pro II Supplemental SOPSOPtamu.edu
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What bake methods are available on the CEE 200?
The CEE 200 supports hard contact baking, in which a substrate is held to the heated plate with vacuum, and proximity baking, in which the substrate is lifted 25 to 100 micrometres above the plate by nitrogen gas for slower temperature ramping.[3]
Is the CEE 200 part of a larger equipment system?
The CEE 200 is a component of the CEE X-Pro II workstation, which also includes spin coaters, an HMDS vapor primer, drainage sensors, and a cooling station.[3]
Not publicly documented
The following facts about the 200 Bake Plate are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 200 Bake Plate are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 200 Bake Plate are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 200 Bake Plate are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 200 Bake Plate are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 200 Bake Plate is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]aggiefab.tamu.edu — aggiefab.tamu.eduaggiefab.tamu.edu
Last updated Sep 27, 2026.
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