CyberOptics
SE600 SPI
CyberOptics SE600 SPI is an automated optical inspection system for SMT PCB inspection. CyberOptics SE600 SPI is a 3D inline solder paste inspection system. CyberOptics SE600 SPI supports a maximum PCB size of 510 × 510 mm.[1][2]
Power
50/60 Hz[1]
Performance
2 µm (certification target)[2]
Optics
Automated Optical Inspection (AOI)[1]
What it is
How it works
The CyberOptics SE600 SPI performs automated optical inspection of solder paste deposits on printed circuit boards.[1][3]
The CyberOptics SE600 uses 3D solder paste inspection to measure paste height, area, volume, and registration, and to detect defects such as insufficient paste, excess paste, offset, bridging, and smear.[2]
Where it fits in the process flow
The CyberOptics SE600 supports process control on PCB assembly lines by inspecting solder paste deposits before downstream placement and reflow operations.[2]
Applications
What do the numbers mean?
Power & electrical4
Optics & imaging3
Performance2
Configuration & options13
Observed configurations
How individual machines were equipped when they appeared on the secondary market — as listed, per unit. These describe one specific machine, not the model in general.
Unit as listed[1]
- 100-120 VAC and 220-240 VAC
- Fully Functional
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What types of defects are typically evaluated?General reference — not yet source-verified
Machines of this class generally look for missing paste, misregistration, inadequate coverage, excess deposition, and other visible print anomalies.
How is the inspection data used?General reference — not yet source-verified
The inspection data is used for pass or fail evaluation, operator review, and process feedback to help maintain stable solder paste printing performance.
Not publicly documented
The following facts about the SE600 SPI are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SE600 SPI are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the SE600 SPI are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the SE600 SPI are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the SE600 SPI are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the SE600 SPI is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]dealer listingwotol.com
- [2]scansmt.com — scansmt.comscansmt.com
- [3]Used CyberOptics SE600 SPI for Sale at SMT Resource Equipment LLC — smtresource.comsmtresource.com
Last updated Oct 9, 2026.
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