Denton Vacuum
635
Wafer size
8"
Power
DC1 pulse or DC, DC2, RF1[1]
Vacuum
Denton Vacuum[1]
Gas delivery
100 sccm MFC controller[1]
Optics
From a few nm to hundreds of nm[1]
What it is
How it works
The Denton 635 uses four confocal cathodes arranged with the cathodes inclined off vertical.[1][3]
The Denton 635 supports sputter power supplies, substrate sputter pre-clean, co-sputtering, and reactive sputtering with nitrogen or oxygen.[1][3]
The Denton 635 uses a water-cooled stage in the standard configuration and can also use a heated stage.[1][3]
Applications
The Denton 635 deposits metals and other thin films for microfabrication.[1]
The Denton 635 has standard targets for gold, chromium, platinum, and titanium, and it can also use other targets with staff approval.[1]
The Denton 635 is used with materials including PET, PMMA, and PDMS.[1][3]
- Magnetron sputtering
- Deposition
What do the numbers mean?
Power & electrical2
- Sputter Power Supplies
- DC1 (DC or pulsed DC), DC2, RF1 (auto-tuning), RF2 (for pre-clean). Switch-control any supply to any cathode, including simultaneous co-sputtering.[3]
Vacuum & pumping6
- Base Pressure
- Base pressure typical < 5×10⁻⁸ Torr; chamber base pressure in 12 hours = 2×10⁻⁷ Torr[3]
Wafer handling7
Gas & chemistry1
Optics & imaging3
Control & software1
Configuration & options13
What replaced it?
Related models
- siblingDenton Vacuum Discovery 18— Listed on the same equipment page under deposition alongside Denton 635.source[2]
- siblingDenton Vacuum SJ20C— Listed on the same equipment page under deposition alongside Denton 635.source[2]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- OEMDenton Vacuum[1]
- Sputter power suppliesDC1 pulse or DC, DC2, RF1[1]
- Chamber base pressure2 x 10^-7 Torr in 12 hours[1]
- Argon pressure range< 1-90 mT[1]
- APC / MFC controller100 sccm MFC controller[1]
- Base PressureBase pressure typical < 5×10⁻⁸ Torr; chamber base pressure in 12 hours = 2×10⁻⁷ Torr[3]
- Chamber Pressure Range< 1-90 mT controllable with APC and 100 sccm Ar MFC controller[3]
- Sputter Power SuppliesDC1 (DC or pulsed DC), DC2, RF1 (auto-tuning), RF2 (for pre-clean). Switch-control any supply to any cathode, including simultaneous co-sputtering.[3]
- Cryo PumpCryo pumped deposition chamber; cryo temperature < 20 K[3]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
How is the film thickness controlled?General reference — not yet source-verified
Film thickness is typically controlled using a quartz crystal microbalance that monitors the mass deposited, or via optical monitoring for anti-reflective coatings. The control system maintains the deposition rate and thickness with high repeatability.
What substrates can be coated?General reference — not yet source-verified
The system can accommodate substrates that fit its chamber, including glass, metal, and plastic components. Fixtures and rotating domes allow multiple pieces to be coated in one batch.
Not publicly documented
The following facts about the 635 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 635 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 635 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 635 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 635 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 635 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]nanofab.utah.edu — nanofab.utah.edunanofab.utah.edu
- [2]nanofab.utah.edu — nanofab.utah.edunanofab.utah.edu
- [3]nanofab.utah.edu — nanofab.utah.edunanofab.utah.edu
Last updated Oct 3, 2026.
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