Disco
DAD 340 Automatic Dicing
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
General reference — not yet source-verifiedDicing saws of this class separate processed wafers into individual die, a step known as singulation. The machine operates automatically, positioning the wafer for precise cutting. Model-specific identity facts include its automatic operation and its positioning within the Disco dicing-saw product line.
How it works
General reference — not yet source-verifiedDicing saws of this class typically employ a high-speed air-bearing spindle to drive a nickel-bonded diamond blade. The wafer is mounted on adhesive tape stretched over a frame, which is held on the chuck table. Cutting fluid, usually deionized water, is applied to the cut zone to cool the blade and flush debris. The machine moves the chuck table in the X and Y axes while the spindle advances in the Z axis for depth control. After dicing, the die remain on the tape for subsequent pick-and-place processing.
Why won't it start?
Documented failure modes, common issues, and field considerations.
- Not operational
- Y-X Axis of Chuck are out of order
What do the numbers mean?
Power & electrical1
- 800 Watt Spindle[4]
Wafer handling5
Optics & imaging1
- Broken Blade Detector (BBD)[4]
Configuration & options6
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Feature800 Watt Spindle[4]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the DAD 340 Automatic Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAD 340 Automatic Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DAD 340 Automatic Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DAD 340 Automatic Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the DAD 340 Automatic Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the DAD 340 Automatic Dicing are on record.
Answerable by: an OEM parts catalog or a service engineer
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
- [4]gtsaz.com — gtsaz.comgtsaz.com
- [5]DAD 340 Automatic Dicing — Disco | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 11, 2026.
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