Disco
DFD 6341 Automatic Dicing
What it is
The Disco DFD 6341 is an automatic dicing saw manufactured by Disco. The machine is designed for 8-inch (200 mm) wafers. Electrical requirements include 200-240 VAC, 3 phase, 50/60 Hz, with a full load current of 20 A, largest load of 8 A, and short circuit rating of 5,000 A.[1]
How it works
General reference — not yet source-verifiedDicing saws use a high-speed rotating abrasive blade to cut along the scribe lines between die on a wafer. The wafer is mounted on dicing tape stretched over a frame. During cutting, the blade is cooled and lubricated with deionized water. Automatic functionality includes cassette-to-cassette wafer handling, pattern-based alignment, and closed-loop control of cut depth and position.
Where it fits in the process flow
General reference — not yet source-verifiedThe dicing saw is used in the back-end of semiconductor manufacturing, after wafer fabrication and electrical testing. The wafer is mounted on a dicing frame with adhesive tape prior to cutting. After singulation, the dice remain on the tape and are transferred to downstream processes such as die attach and packaging.
What do the numbers mean?
Power & electrical3
- 50/60 Hz[1]
Wafer handling1
- Transfer[2]
Optics & imaging2
- Epi illumination oblique lighting[2]
Control & software1
Configuration & options19
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- ADT 7500 Dicing— Same function class: Dicing & Grinding, UnknownCompare in depthsource[8]
- Veeco ADS 800 Dicing— Same function class: Dicing & Grinding, nullCompare in depthsource[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the DFD 6341 Automatic Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFD 6341 Automatic Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFD 6341 Automatic Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFD 6341 Automatic Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFD 6341 Automatic Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFD 6341 Automatic Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (9)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]Inventory photo
- [7]inventory listing
- [8]Equipment inventory listing
- [9]Equipment inventory listing
Last updated Sep 28, 2026.
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