Disco
DFG 8830
The Disco DFG 8830 is a wafer grinder for semiconductor materials such as SiC. The DFG 8830 handles wafers of 6 inch (150 mm) and 8 inch. The DFG 8830 has four spindles with power of 6.3 kW and speed range 1,000–4,000 min⁻¹, and five work stations.[1]
What it is
How it works
General reference — not yet source-verifiedA grinder removes material from the wafer surface by controlled abrasive action to achieve fine thickness and surface condition targets.
Where it fits in the process flow
General reference — not yet source-verifiedThe DFG 8830 sits in the wafer thinning and backside processing portion of the flow.
What do the numbers mean?
Power & electrical3
Wafer handling2
Dimensions & facilities4
Configuration & options15
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What materials can this class of dicing saw handle?General reference — not yet source-verified
Dicing saws can cut a wide range of materials including silicon, gallium arsenide, silicon carbide, sapphire, glass, ceramics, and various laminated substrates used in semiconductor packaging. The blade and process parameters are selected to match the material properties.
How is cutting accuracy maintained?General reference — not yet source-verified
Cutting accuracy is achieved through precision spindle design, rigid machine construction, and closed-loop feedback systems that control blade position and stage movement. Regular calibration, blade dressing, and proper process parameter selection help maintain kerf consistency and alignment.
What factors influence cutting speed?General reference — not yet source-verified
Cutting speed depends on material hardness, blade type, desired cut quality, and required throughput. Operators adjust feed rate, spindle speed, and depth of cut to optimize performance for each specific application.
What routine maintenance is typical for dicing saws?General reference — not yet source-verified
Routine maintenance includes blade dressing or replacement, cleaning the spindle and cutting area, changing coolant filters, checking and topping up coolant, and periodically verifying machine alignment and calibration. Proper maintenance extends blade life and ensures consistent cut quality.
Can the saw handle different die sizes and street patterns?General reference — not yet source-verified
Yes, modern dicing saws are programmable and can accommodate various die sizes, street widths, and cutting patterns. The machine's software controls blade path, cutting sequence, and positioning to align with product design requirements.
Not publicly documented
The following facts about the DFG 8830 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFG 8830 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFG 8830 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFG 8830 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFG 8830 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFG 8830 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]web.archive.org — disco.co.jp (Feb 22, 2020)web.archive.org
Last updated Oct 1, 2026.
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