Disco
DFP 8160 Fully Automated
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Disco DFP 8160 Fully Automated is a fully automated polisher. The Disco DFP 8160 Fully Automated is for 8-inch to 12-inch wafers. The Disco DFP 8160 Fully Automated is categorized as CMP.[1][2]
What it is
How it works
General reference — not yet source-verifiedA CMP polisher removes material from a wafer surface by controlled mechanical action with a polishing interface and process chemistry.
A fully automated polisher handles wafer movement, process sequencing, and polishing cycle control within the equipment.
Where it fits in the process flow
General reference — not yet source-verifiedCMP sits in the wafer finishing flow after earlier surface formation steps and before later inspection or downstream fabrication steps that depend on planarized surfaces.
The Disco DFP 8160 Fully Automated serves processes that need surface planarization and thickness or topography correction on handled wafers.
Applications
General reference — not yet source-verifiedThe Disco DFP 8160 Fully Automated supports wafer planarization in semiconductor manufacturing.
What do the numbers mean?
Wafer handling1
Configuration & options4
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What type of equipment is the Disco DFP 8160 Fully Automated?
Is the Disco DFP 8160 Fully Automated automated?
The Disco DFP 8160 Fully Automated is fully automated.[1]
What wafer sizes does the Disco DFP 8160 Fully Automated handle?
The Disco DFP 8160 Fully Automated is a fully automated polisher for eight-inch to twelve-inch wafers.[1]
Not publicly documented
The following facts about the DFP 8160 Fully Automated are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFP 8160 Fully Automated are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFP 8160 Fully Automated are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFP 8160 Fully Automated are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFP 8160 Fully Automated are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFP 8160 Fully Automated is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]waferpedia.com — waferpedia.comwaferpedia.com
- [2]Equipment inventory listing
- [3]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 4, 2026.
Compare with similar tools
View all →
The Logitech 1 DP 41 is a polisher with 3-phase, 50/60 Hz, 480 V, 12 amp electrical requirements.
The Strasbaugh 100R16 is a 1-spindle grinder/polisher with a DC drive system and 2 motors. The Strasbaugh 100R16 has a 16-inch capacity.
The Lapmaster 12 Benchtop Lapping / Polishing Machine is a bench-mounted single-sided lapping and polishing machine with a 12-inch plate diameter.
