Disco
DTG 8460 Taiko
The Disco DTG 8460 Taiko Grinder is a cassette-to-cassette grinder configured for 12-inch wafers. The DTG 8460 Taiko uses 3 chucks and includes an add-on chiller (DTU 1531), USV, duct unit, and vacuum unit.[1][2][3]
What it is
General reference — not yet source-verifiedThe Disco DTG 8460 Taiko is a wafer back-grinding tool that performs the Taiko process, a grinding method that leaves a thick edge ring on the wafer while thinning the central area, allowing the wafer to be handled without a support tape during subsequent processing.
How it works
General reference — not yet source-verifiedWafer back-grinding machines use a rotating grinding wheel with diamond abrasives to remove material from the back side of a silicon wafer, reducing its thickness. The wafer is held on a vacuum chuck and the grinding spindle is lowered incrementally while coolant is supplied to the grinding interface.
In the Taiko process, the grinding wheel first cuts a recess in the center of the wafer, leaving a peripheral ring of full thickness. The ring provides mechanical strength and allows the wafer to be transported and processed without a carrier tape. Subsequent steps may remove the ring or the wafer is singulated while the ring remains.
Where it fits in the process flow
General reference — not yet source-verifiedFollowing back-grinding, the wafer may be transferred to a wafer cleaner, then to a dicing saw or laser grooving tool for singulation. The Taiko edge ring enables thin-wafer handling without additional support, which simplifies the process flow for applications such as stacked-die packaging or ultra-thin devices.
What do the numbers mean?
Power & electrical5
Vacuum & pumping2
- Add on Chiller (DTU 1531), USV, Duct Unit, Vacuum Unit[1]
Wafer handling3
- Cassette to Cassette[1]
Configuration & options5
- 3 Chucks[1]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| DTG 8460 Wafer Backside | — | — | — | waferpedia.com[2] |
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Strasbaugh 7 AF Back— Same function class: Dicing & Grinding, nullCompare in depthsource[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the DTG 8460 Taiko are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DTG 8460 Taiko are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the DTG 8460 Taiko are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DTG 8460 Taiko are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DTG 8460 Taiko is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the DTG 8460 Taiko are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]waferpedia.com — waferpedia.comwaferpedia.com
- [3]waferpedia.com — waferpedia.comwaferpedia.com
- [4]Inventory photo
- [5]tarasemi.com — tarasemi.comtarasemi.com
- [6]Disco DTG8460 — wotol.comwotol.com
Last updated Oct 7, 2026.
Compare with similar tools
View all →
The Strasbaugh 7 AF Back Grinder is a wafer back-grinding tool that can process 8-inch silicon wafers.
The Lapmaster Model 15 is a bench-mounted unit with a rigid, lightweight, cast aluminum base, of the 'ring lapper' configuration, enabling high standards of flatness and surface finish.
General referenceThe Blanchard 18 D Surface is a vertical-spindle rotary-table surface grinding machine used to produce flat, parallel surfaces on metal workpieces.
