Electroglas
EG5
Electroglas EG5 is a wafer prober line. Electroglas EG5|300 ARGOS is an Electroglas wafer prober. Electroglas EG5|300 ARGOS is capable of handling 150mm, 200mm, and 300mm wafers.[1]
Wafer size
150mm
Performance
±2.5 micron[1]
What it is
The EG5|300 ARGOS is a variant of the EG5 platform designed for 300 mm wafers, targeting high-accuracy probing of leading-edge devices. The system achieves a probe-to-pad accuracy of ±2.5 micrometer and a stepping accuracy of 1.0 micrometer.[1]
How it works
The EG5|300 ARGOS uses an air-bearing, closed-loop linear motion system that is wear- and maintenance-free. The stage design and motion control algorithms provide 1.0 micrometer stepping accuracy while maintaining high stepping speeds.[1]
The system includes an integrated alignment system that enables the ±2.5 micrometer probe-to-pad accuracy, which is critical for contacting fine-pitch pads on advanced devices.[1]
Applications
General reference — not yet source-verifiedWafer probers are used for device characterization, parametric testing, and sort testing to classify die by performance and yield.
- extremely tight-pitch probing on leading edge devices
- fine-pitch probing for in-line parametric test structures
What do the numbers mean?
Wafer handling4
Performance3
Configuration & options5
- Model relation
- EG5|300e is a fine-pitch probing model for in-line parametric test structures[1]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| EG5|300 ARGOS | — | — | Described as Electroglas' highest accuracy 300mm wafer prober; includes precise stepping accuracy, integrated alignment system, air bearing closed-loop linear motion system, and capability for 150mm, 200mm, and 300mm wafers. | web.archive.org[1] |
| EG5|300e | — | — | Fine-pitch probing for in-line parametric test structures. | web.archive.org[1] |
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What does a wafer prober do during test?General reference — not yet source-verified
A wafer prober positions a semiconductor wafer beneath a probe card, lowers the probes onto the bond pads of each die, and electrically connects those pads to a test system for measurement.
How does the machine align to the wafer before probing?General reference — not yet source-verified
The prober uses optical alignment and pattern recognition to locate fiducial marks and pad sites on the wafer, then moves the wafer in a step-and-repeat manner so each die can be probed at the correct position.
What types of tests can be performed on a wafer prober?General reference — not yet source-verified
Wafer probers support direct-current and high-frequency electrical tests, parametric measurements, functional test, and simple reliability screening, depending on the instrumentation connected to the system.
What factors affect probing accuracy and repeatability?General reference — not yet source-verified
Wafer flatness, pad topology, probe tip planarity, stage drift, thermal expansion, and contact force all influence measurement integrity. Calibration and routine cleaning of probe tips are needed to maintain consistent performance.
Not publicly documented
The following facts about the EG5 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the EG5 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the EG5 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the EG5 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the EG5 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the EG5 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]web.archive.org — web.archive.orgweb.archive.org
- [3]web.archive.org — web.archive.orgweb.archive.org
Last updated Oct 4, 2026.
Compare with similar tools
View all →The SUSS PM5 is an analytical probe system intended for precise analysis of devices fabricated on wafers and substrates up to 150 mm in diameter.
The Signatone WL-1160 is an RF/microwave probe station designed for high-frequency, high-power, and millimeter-wave applications.