Esec
3100 Plus
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The ESEC 3100 Plus is a wire bonder used for precise bonding of gold wire. The ESEC 3100 Plus includes a microscope with two eyepieces and a software interface for controlling bonding parameters.[1][2][3]
What it is
How it works
The Esec 3100 Plus has a control panel with an emergency stop button, a microscope with two eyepieces, an adjustable arm light, and a monitor for the WB3100plus software interface.[3]
Applications
The Esec 3100 Plus is used for precise bonding applications.[3]
The Esec 3100 Plus is used in industrial wire bonding tasks that require detailed and accurate placement.[3]
What do the numbers mean?
Optics & imaging1
Control & software2
Configuration & options3
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What type of machine is the Esec 3100 Plus?
The Esec 3100 Plus is a wire bonder used in packaging and bonding work.[1][4][2]
What kind of wire bonding does the Esec 3100 Plus support?
The Esec 3100 Plus is a gold wire bonder.[2]
What operator-visible features are present on the Esec 3100 Plus?
The Esec 3100 Plus has a control panel with an emergency stop button, a microscope with two eyepieces, an adjustable arm light, and a monitor for the WB3100plus software interface.[3]
Not publicly documented
The following facts about the 3100 Plus are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 3100 Plus are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 3100 Plus are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 3100 Plus are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 3100 Plus are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 3100 Plus is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]bondztek.com — bondztek.combondztek.com
- [3]exapro.com — exapro.comexapro.com
- [4]3100 Plus — Esec | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Sep 27, 2026.
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