ESPEC
TSE 12 A Thermal Shock
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The ESPEC TSE-12-A is a thermal shock chamber designed for testing products by transferring them between cold and hot zones. The TSE-12-A has a temperature range of -65°C to 200°C and an interior volume of 0.4 cubic feet. The TSE-12-A is a vertical-lift thermal shock chamber with separate hot and cold zones, and it uses a non-CFC cascade refrigeration system.[1][2]
What it is
The TSE-12-A is a vertical-lift thermal shock chamber with separate hot and cold temperature zones. The chamber has an interior volume of 0.4 cubic feet and interior dimensions of 12.5 inches wide by 9.1 inches deep by 5.8 inches high. Exterior dimensions are 26 inches wide by 42 inches deep by 79 inches high. The temperature range of the TSE-12-A is -65 to 200 degrees Celsius. The chamber operates on 208 volt, three-phase, 60 Hz power and requires 30 service amps with 26 full-load amps.[1][2][3]
How it works
The TSE-12-A uses a vertical-lift design to move specimen baskets between the hot and cold zones. A direct-drive system provides reliable transfer. The hot zone is maintained by electrical heating and the cold zone by a non-CFC cascade refrigeration system using two 2-horsepower compressors. Two sirocco blower motors circulate air, one per zone. The chamber operates at sound levels below 60 decibels. A touch-screen programmer with a 7-inch color display controls the cycles, and up to 20 user-definable programs can be saved. An Ethernet connection with browser-based access and USB ports are standard.[1][2]
What do the numbers mean?
Power & electrical5
Wafer handling1
- Transfer Mechanism
- Vertical-lift, direct-drive system for reliable transfer between zones[1]
Control & software3
Dimensions & facilities8
- Exterior Dimensions (W x D x H)
- 26" x 42" x 79" (NEC compliant version) (680 x 1050 x 2007 mm)[2]
- Compliance
- Meets Mil-Std 883 1010.7/1010.8 thermal cycling requirements with 4 kg load; also can be used for IEC 61300-2-47, JEDEC JESD47E, JESD22-A104, and others[1]
- Test Performance Example
- Test: Mil-Std 883 1010.7 Range: -65 to 150°C Recovery: 15 min. (worst-case on-product) Load: 6 lb of IC chips[2]
- Test performance example
- Mil-Std 883 1010.7; range -65 to 150°C; recovery 15 min. (worst-case on-product); load 6 lb of IC chips[2]
Configuration & options14
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
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Frequently asked questions
Not publicly documented
The following facts about the TSE 12 A Thermal Shock are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the TSE 12 A Thermal Shock are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the TSE 12 A Thermal Shock are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the TSE 12 A Thermal Shock are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the TSE 12 A Thermal Shock are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the TSE 12 A Thermal Shock is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Last updated Oct 9, 2026.
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