Waferpedia

EV Group

520

520 — Inventory photo
Fig. 01520Inventory photo[1]

Wafer size

Manual wafer load substrate bonder

Power

50 / 60 Hz[1]

Vacuum

High-vacuum capable bond chamber[1]

Performance

± 1,5 %[1]

What it is

The EVG 520 Bonder is a manual wafer load substrate bonder with support for fusion bonding, thermal compression bonding, and anodic bonding.[1]

The EVG520 IS is a semi-automated wafer bonding system for low-volume production.[2]

How it works

The EVG 520 Bonder includes a high-vacuum capable bond chamber, auto opening of the bond tool cover, a vacuum chuck, top and bottom heaters, a turbo pump and controller, and a roughing pump.[1]

The EVG520 IS uses a proprietary symmetric rapid heating and cooling chuck design and supports fully automated processing with manual loading and unloading.[2]

Where it fits in the process flow

The EVG520 IS is compatible with EVG mechanical and optical aligners and includes an integrated cooling station for higher throughput.[2]

Applications

The EVG 520 Bonder supports wafer sizes up to 150 mm, a maximum bond force of 7 kN, and top-side and bottom-side heating to 550°C in 1°C steps.[1]

The EVG520 IS supports anodic bonding with a maximum voltage of 2 kV and a maximum current of 50 mA.[2]

What do the numbers mean?

Power & electrical5

50 / 60 Hz[1]
Accurate?
120 / 208 V[1]
Accurate?
Phase
3 Phase[1]
Accurate?
Power requirements
50 / 60 Hz - 120 / 208 V - 3 Phase[1]
Accurate?
Anodic bonding power supply (EVG520 IS)
Max. voltage: 2 kV; max. current: 50 mA[2]
Accurate?

Vacuum & pumping8

High-vacuum capable bond chamber[1]
Accurate?
Vacuum Chuck
6"/150mm diameter chuck[1]
Accurate?
Turbo pump and controller[1]
Accurate?
Roughing pump[1]
Accurate?
Bond chamber
High-vacuum capable bond chamber[1]
Accurate?
Pumping
Turbo pump and controller; roughing pump[1]
Accurate?
Vacuum standard (EVG520 IS)
1E-5 mbar[2]
Accurate?
Vacuum optional (EVG520 IS)
1E-6 mbar[2]
Accurate?

Wafer handling8

Wafer size
Manual wafer load substrate bonder[1]
Accurate?
Wafer Size
up to 150 mm capable[1]
Accurate?
Load type
Manual wafer load substrate bonder[1]
Accurate?
Wafer size (as configured)
6 inch[1]
Accurate?
Wafer size capability
up to 150 mm capable[1]
Accurate?
System configuration (EVG520 IS)
Single or dual chamber wafer bonding system[2]
Accurate?
Minimum substrate dimension (EVG520 IS)
single chips 100 mm[2]
Accurate?
Chuck / alignment systems (EVG520 IS)
150 mm heater: EVG 610, EVG 620, EVG 6200; 200 mm heater: EVG 6200, SmartView NT[2]
Accurate?

Optics & imaging1

Aligner compatibility (EVG520 IS)
Compatible with EVG mechanical and optical aligners[2]
Accurate?

Performance2

Temperature uniformity
± 1,5 %[1]
Accurate?
Cooling (EVG520 IS)
Integrated cooling station for high throughput; active water cooling top and bottom; integrated cooling optional[2]
Accurate?

Control & software2

Windows based control software and operation interface[1]
Accurate?
Control software
Windows based control software and operation interface[1]
Accurate?

Configuration & options25

Refurbished[1]
Accurate?
Capable of fusion & thermal compression bonding[1]
Accurate?
Capable of anodic bonding[1]
Accurate?
Auto opening of bond tool cover[1]
Accurate?
Max Bond Force
7 kN[1]
Accurate?
Top Side Heater
550°C max. in 1°C steps[1]
Accurate?
Bottom Side Heater
550°C max. in 1°C steps[1]
Accurate?
Thermoflex 1400 Chiller (or equivalent)[1]
Accurate?
Load / unload tool[1]
Accurate?
OEM
EV Group[1]
Accurate?
Model
520[1]
Accurate?
Max bond force (configured system)
7 kN[1]
Accurate?
Top side heater max temperature
550°C max. in 1°C steps[1]
Accurate?
Bottom side heater max temperature
550°C max. in 1°C steps[1]
Accurate?
Bonding capability (configured system)
Fusion & thermal compression bonding; anodic bonding[1]
Accurate?
Bond tool cover
Auto opening of bond tool cover[1]
Accurate?
Chiller
Thermoflex 1400 Chiller (or equivalent)[1]
Accurate?
Automation (EVG520 IS)
Fully automated processing with manual loading and unloading including external cooling station[2]
Accurate?
Chambers (EVG520 IS)
Single- or double-chamber automated system[2]
Accurate?
Max contact force (EVG520 IS)
10, 20, 60, 100 kN[2]
Accurate?
Heater size (EVG520 IS)
150 mm, 200 mm[2]
Accurate?
Max temperature (EVG520 IS)
Standard: 550 °C; Optional: 650 °C[2]
Accurate?
Single chips processing (EVG520 IS)
Yes[2]
Accurate?
Loading chamber (EVG520 IS)
Manual[2]
Accurate?
Max bond chambers (EVG520 IS)
2[2]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
EVG520 IS——Semi-automated wafer bonding system with fully automated processing, manual loading/unloading, external cooling station, and compatibility with EVG mechanical and optical aligners.evgroup.com[2]
Interested in this tool?
Need help with this tool?Embed spec card

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Configuration50 / 60 Hz[1]
  • Configuration120 / 208 V[1]
  • Phase3 Phase[1]
  • ConfigurationHigh-vacuum capable bond chamber[1]
  • Vacuum Chuck6"/150mm diameter chuck[1]
  • ConfigurationTurbo pump and controller[1]
  • ConfigurationRoughing pump[1]
  • Power requirements50 / 60 Hz - 120 / 208 V - 3 Phase[1]
  • Bond chamberHigh-vacuum capable bond chamber[1]
  • PumpingTurbo pump and controller; roughing pump[1]
  • Vacuum standard (EVG520 IS)1E-5 mbar[2]
  • Vacuum optional (EVG520 IS)1E-6 mbar[2]
  • Anodic bonding power supply (EVG520 IS)Max. voltage: 2 kV; max. current: 50 mA[2]

Parts & consumables

Tracked replaceable assemblies, spares criticality, and availability status across all major subsystems. Each entry cites its source.

  • EVG 520 IS Manual Wafer Load Substrate BonderIn Productionsource[3]
  • EVG 520 Manual Wafer Load Substrate BonderIn Productionsource[4]
  • EVG 520 Manual Wafer Load Substrate BonderIn Productionsource[5]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Worked with this tool? Help preserve its knowledge →

Not publicly documented

The following facts about the 520 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 520 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the 520 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 520 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 520 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly hosted manuals, SOPs, or datasheets for the 520 are on record.

    Answerable by: university cleanroom staff or an OEM application specialist

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (5)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]evgroup.com — evgroup.comevgroup.com
  3. [3]Equipment inventory listing
  4. [4]Equipment inventory listing
  5. [5]Equipment inventory listing
Was this page accurate?

Last updated Oct 11, 2026.

Compare with similar tools

View all →