Hesse & Knipps
Bondjet BJ 855
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Bondjet BJ855 is a fully automated fine wire bonder manufactured by Hesse GmbH. The Bondjet BJ855 supports wedge-wedge and ball-wedge bondheads. The Bondjet BJ855 is benchmarked against competition for the fastest bonding speed in the industry, the largest working area, and the greatest axis accuracy.[1]
What it is
The Bondjet BJ855 is a fully automatic fine wire bonder. The machine performs wire bonding with wedge-wedge and ball-wedge bondheads.[1][3]
How it works
The Bondjet BJ855 forms electrical interconnects by wire bonding between pads and bond sites. The machine uses ultrasonic energy, programmable bondhead motion, and pattern recognition to place and form bonds.[1][3]
The Bondjet BJ855 supports wedge-wedge bonding with selectable bondhead angles and ball-wedge bonding with multi-level bonding. The machine also supports programmable wire feed, tail length, tear stroke, and wire-clamp opening gap.[1][3]
Where it fits in the process flow
Applications
What do the numbers mean?
Power & electrical2
Vacuum & pumping1
Control & software1
- Interfaces
- Gigabit Ethernet (TCP/IP), USB ports, HDMI, SMEMA connection, Profibus support[3]
Dimensions & facilities3
- Ribbon dimensions
- Al, Au: 35 µm x 6 µm up to 250 µm x 25 µm (1.4 mil x 0.25 mil up to 10 mil x 1 mil)[1]
Configuration & options13
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wire diameters and materials does the Bondjet BJ 855 support?
The Bondjet BJ 855 supports aluminum, gold, silver, copper, platinum, and nickel wires from 12.5 µm to 75 µm (0.5 mil to 3 mil) depending on bondhead and application. Ribbon materials include aluminum and gold from 35 µm x 6 µm up to 250 µm x 25 µm.[1][3][4]
What is the bonding speed of the BJ 855?
The Bondjet BJ 855 can achieve up to 7 wires per second, depending on application and bondhead, for example with a wedge-wedge bondhead, 25 µm wire, and 1 mm loop length on a metallized wafer.[1][3][4]
What bondhead types are available for the BJ 855?
The Bondjet BJ 855 supports both wedge-wedge and ball-wedge bondheads. Wedge-wedge bondheads are available with wire feed angles of 45°, 60°, and 90° (deep access for ribbon or wire). Ball-wedge bondheads use capillaries of 11/19 mm and provide ultrasonic bonding in the preferred direction through bondhead rotation.[1][3][4]
Not publicly documented
The following facts about the Bondjet BJ 855 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Bondjet BJ 855 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Bondjet BJ 855 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Bondjet BJ 855 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Bondjet BJ 855 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Bondjet BJ 855 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]hesse-mechatronics.com — hesse-mechatronics.comhesse-mechatronics.com
- [2]Inventory photo
- [3]hesse-mechatronics.com — hesse-mechatronics.comhesse-mechatronics.com
- [4]accelonix.nl — accelonix.nlaccelonix.nl
Last updated Sep 27, 2026.
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