Hitachi
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The Hitachi 9300 is a semiconductor manufacturing equipment model designation used by Hitachi. The Hitachi S-9300 is a high-resolution critical dimension scanning electron microscope for semiconductor wafer metrology. The Hitachi S-9300 can load 200 mm wafers or 300 mm wafers.[1][2]
Power
500V to 1600V, 10V steps[2]
Performance
3 sigma 5nm without auto-focus[2]
Optics
1000X to greater than 300,000X[2]
The Hitachi 9300 is a semiconductor manufacturing equipment model designation used by Hitachi.[3][1]
The designation refers to the Hitachi S-9300, a high-resolution critical dimension scanning electron microscope (CD-SEM) for semiconductor wafer metrology.[2][5]
The system uses a Schottky emission electron source, an accelerating voltage range of 500V to 1600V, and a three-stage electromagnetic lens system with boosting voltage.[2]
The S-9300 provides magnification from 1000X to greater than 300,000X and achieves a resolution of 3nm at 800V.[2]
The tool includes a SECS/GEM communication interface, dual XY stages, Hitachi microscale DSP image processing, and backscattered electron (BSE) mode functionality.[2]
Static measurement accuracy is 3 sigma 5nm without auto-focus, and the tool demonstrates loading reliability with 25 load operations without error on both ports A and B.[2]
Throughput is 28 wafers per hour, and auto-addressing accuracy is within plus or minus 3.0 micrometers in both x and y directions.[2]
Applications of the Hitachi S-9300 include critical dimension measurement for process control, edge roughness evaluation, multipoint measurement, and imaging of wafer surfaces at high magnification.[2]
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The Hitachi 9300 is a semiconductor manufacturing equipment model designation used by Hitachi. The Hitachi S-9300 is a high-resolution critical dimension scanning electron microscope for semiconductor wafer metrology.[1]
The Hitachi S-9300 can load 200 mm wafers or 300 mm wafers.[1][2]
The Hitachi S-9300 uses a Schottky emission electron source.[1][2]
The Hitachi S-9300 supports critical dimension measurement, edge roughness evaluation, multipoint measurement, and imaging of wafer surfaces at high magnification.[1]
The following facts about the 9300 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 9300 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 9300 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 9300 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 9300 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 9300 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 7, 2026.