Hybond
572 A 40 Thermosonic Wire & Ribbon
The Hybond 572 A 40 is a thermosonic wire and ribbon bonder designed for deep-access and long-reach bonding. The 572 A 40 features HYBOND Soft-Touch bonding technology for sensitive materials such as GaAs and InP. The bonder includes a motorized vertical wire feed, independent Z-axis lever, and a 6 x 8.5 inch work platform.[1][2][3]
What it is
How it works
The 572 A 40 uses a manual bond head with an independent Z-axis lever, a fixed-height lever-actuated bond switch, a motorized vertical wire feed, and a 90-degree wire-in-tool feed path.[1][2][3][4]
The 572 A 40 includes independent control of first and second bond parameters, adjustable tail length, loop height control, audio and visual bond-fault indicators, and a front-panel ultrasonic test button.[4][2][3]
Where it fits in the process flow
General reference — not yet source-verifiedWire bonding is a packaging step used to create electrical interconnections between a die and a package lead frame or substrate.
Applications
The Hybond 572 A 40 can bond wire diameters from 0.5 to 2.0 mils.[1][2][3]
The 572 A 40 can bond ribbon up to 1 by 10 mils and can bond gold, aluminum, copper, silver, and platinum.[1][2][3]
The 572 A 40 is positioned for sensitive compound-semiconductor materials such as gallium arsenide and indium phosphide.[1][2][3]
What do the numbers mean?
Power & electrical4
Vacuum & pumping1
Control & software6
Dimensions & facilities7
Configuration & options43
- Long reach[4]
- 08A, 31, 45, 67[4]
- Hybond Soft Touch energy system[4]
- Motorized vertical wire feed[4]
- 1-1-2, 1-2-2 & 1-2-1 stitch capability[4]
- 0.5 and 2 inch spool mounts[4]
- Swing-away wire clamp assembly[4]
- Deep vertical access of 0.59″ (1,49cm)[4]
- Horizontal reach of 3.5″ (8,89cm)[4]
- Deep access Wire-In-Tool 90° wire feed[4]
- Wire and ribbon bonding capability[4]
- Tail length adjustable[4]
- Audio & visual bond sequence fault indicators[4]
- 6 x 8.5 inch work platform[4]
- LED display of work stage temperature[4]
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Kulicke & Soffa Rapid Plus— Same function class: Packaging & Bonding, UnknownCompare in depthsource[5]
- ASM AD 838 L— Same function class: Packaging & Bonding, UnknownCompare in depthsource[6]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Ultrasonic systemPLL self-tuning, 62.5 KHz (±2.5KHz) nominal[2]
- Ultrasonic power range0-1 watt on Low setting (default), 0-2 watts on High setting[2]
- Vacuum requirement20 inHg minimum[2]
- Ultrasonic systemPLL self-tuning, 62.5 kHz nominal (±2.5 kHz)[2]
- Ultrasonic power range0-1 watt low setting, 0-2 watts high setting[2]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wire diameters can the Hybond 572 A 40 bond?
The Hybond 572 A 40 can bond wire diameters from 0.5 to 2.0 mils.[1][2][3]
What ribbon size can the Hybond 572 A 40 handle?
The Hybond 572 A 40 can handle ribbon up to 1 by 10 mils.[1][2][3]
What ultrasonic frequency does the Hybond 572 A 40 use?
The Hybond 572 A 40 uses a self-tuning PLL ultrasonic system at a nominal frequency of 62.5 kHz with a tolerance of plus or minus 2.5 kHz.[1][2][3]
Not publicly documented
The following facts about the 572 A 40 Thermosonic Wire & Ribbon are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 572 A 40 Thermosonic Wire & Ribbon are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 572 A 40 Thermosonic Wire & Ribbon are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 572 A 40 Thermosonic Wire & Ribbon are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 572 A 40 Thermosonic Wire & Ribbon are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 572 A 40 Thermosonic Wire & Ribbon is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]waferpedia.com — waferpedia.comwaferpedia.com
- [2]hybond.com — hybond.comhybond.com
- [3]hybond.com — hybond.comhybond.com
- [4]Inventory photo
- [5]Equipment inventory listing
- [6]Equipment inventory listing
Last updated Oct 7, 2026.
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