KLA

2367

Metrology & Inspection Only one wafer size at a time KLA 2367 family

Research Quality: 50% complete

The KLA 2367 is a UV/visible brightfield inspector. The KLA 2367 provides sensitivity to yield-relevant defect types for 65nm and above design nodes. The KLA 2367 supports 8 inch and 12 inch wafer sizes and only one wafer size at a time.^[1]

2367 — Inventory photo — Fig. 012367Inventory photo^[2]

What it is

The KLA 2367 is a UV/visible brightfield inspection system manufactured by KLA (formerly KLA-Tencor). The system is designed for defect detection at the 65nm and above design nodes.^[1]

The KLA 2367 supports 200 mm (8 inch) and 300 mm (12 inch) wafer sizes, but operates with only one wafer size at a time. For 300 mm wafers, the system uses a Yaskawa robot with an Asyst ISO Port or Shinko LP; for 200 mm wafers, it uses a Yaskawa robot with an Asyst Versa Port (SMIF).^[2]

How it works

General reference — not yet source-verified

Brightfield inspection systems illuminate the wafer with a broadband light source and detect defects by analyzing variations in the reflected light. The wafer is scanned under an optical microscope and high-sensitivity detectors capture the reflected signal.

Where it fits in the process flow

General reference — not yet source-verified

In the fab, brightfield inspection typically occurs after lithography, etch, planarization, and other process steps to catch defects before they affect yield. The system can be integrated with other KLA-Tencor inspection and review tools for recipe setup and data analysis.

What do the numbers mean?

Wafer handling3

Wafer size: Only one wafer size at a time^[2]
Wafer sizes: 8 inch, 12 inch^[2]
Wafer handling: only one wafer size at a time^[2]

Control & software1

Software version: 10.4.507^[2]

Configuration & options18

SW Version: 10.4.507^[2]
300 mm (12"): Yaskawa + Asyst ISO Port or^[2]; Shinko LP^[2]
200 mm (8"): Yaskawa + Asyst Versa Port (SMIF)^[2]
GL: G Line^[2]
IL: I Line^[2]; 0.12 UV/GL/IL^[2]; 0.16 UV/GL/IL^[2]; 0.20 UV/GL/IL^[2]
VIS: Visible^[2]; 0.25 VIS^[2]; 0.39 VIS^[2]; 0.62 VIS^[2]
Equipment type: UV/visible brightfield inspector^[1]
Inspection focus: sensitivity to a broad range of yield-relevant defect types^[1]
Design node: 65nm and above^[1]
Lighting modes: GL: G Line; IL: I Line; VIS: Visible^[2]
Inspection thresholds: 0.12 UV/GL/IL; 0.16 UV/GL/IL; 0.20 UV/GL/IL; 0.25 VIS; 0.39 VIS; 0.62 VIS^[2]

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Parts & consumables

Tracked replaceable assemblies, spares criticality, and availability status across all major subsystems. Each entry cites its source.

KLA 2367 Y MotorIn Productionsource^[3]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What wafer sizes does the KLA 2367 support?

The KLA 2367 supports 200 mm (8 inch) and 300 mm (12 inch) wafers, but only one size at a time.^[2]

What design nodes is the KLA 2367 intended for?

The KLA 2367 is designed for the 65nm and above design nodes.^[1]

Is the KLA 2367 field-upgradeable?

Yes, the KLA 2367 is field-upgradeable from other 23xx systems.^[1]

What is the throughput improvement of the KLA 2367 compared to previous generation?

The KLA 2367 provides a 2x data rate increase over previous generation brightfield tools, improving throughput.^[1]

Not publicly documented

The following facts about the 2367 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2367 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 2367 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 2367 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2367 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2367 is not on record.
Answerable by: an OEM datasheet or a fab qualification report