KLA
P 22 H Surface
The KLA P 22 H Surface is a surface profilometer used for step height precision micro 2D scanning. The KLA P 22 H Surface includes dual view optics, a motorized precision 200 mm diameter X-Y vacuum sample stage, and a 2 µm radius stylus. The KLA P 22 H Surface operates on a Windows-based system with a scan length of 60 mm and adjustable stylus force.[1][2]
Wafer size
Automated Wafer Handler
Power
5, 10, 20, 50, 100, 200, 500 , 1000 Hz[1]
Performance
Step Height Precision Micro 2D Scanner[1]
Optics
Dual View Optics[1]
What it is
The KLA P 22 H Surface is configured as a step height precision micro two-dimensional scanner with dual-view optics and a motorized 200 millimeter diameter X-Y vacuum sample stage.[1][2]
The KLA P 22 H Surface is part of the KLA P family of profilometers and is categorized under metrology and inspection equipment.[4][5]
How it works
Where it fits in the process flow
Applications
What do the numbers mean?
Power & electrical1
Vacuum & pumping2
- Motorized precision 200mm Diameter X-Y vacuum sample stage[1]
Wafer handling2
Optics & imaging6
Performance2
- Step Height Precision Micro 2D Scanner[1]
Control & software1
Dimensions & facilities1
Configuration & options24
- Stylus, 2 um Radius 60[1]
- Window based Operation system,[1]
- Clean room Operation Manual[1]
- LCD Monitor[1]
- General Performance[1]
- +,- 13um/0.0075A[1]
- +,-65um/0.04A[1]
- 327um/0.19A[1]
- 200mm diameter stage moving[1]
- Data Screen
- display scan, roughness, data summary table listing up to 27 parameters ( total 48 )[1]
- Data Output
- Data Screen (display scan, roughness, data summary table listing up to 27 parameters total 48), Database Manager, ASCII Output[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the typical throughput of such a system?General reference — not yet source-verified
Throughput varies by model and application, but these systems are generally capable of inspecting a full wafer in a matter of minutes, depending on resolution and scan area requirements. Higher throughput is achieved for coarser inspections.
Can the system be used for both patterned and unpatterned wafers?General reference — not yet source-verified
Many surface inspection systems offer modes for both patterned and unpatterned wafers. Patterned wafer inspection often requires more advanced algorithms to distinguish intentional features from defects, while unpatterned wafer inspection is more straightforward.
What are the typical maintenance requirements for this class of tool?General reference — not yet source-verified
Regular maintenance includes cleaning of optical components, calibration of the stage and detection system, and verification of sensitivity using test wafers with known defect types. Preventive maintenance intervals are typically based on usage hours or wafer counts.
Not publicly documented
The following facts about the P 22 H Surface are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the P 22 H Surface are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the P 22 H Surface are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the P 22 H Surface are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the P 22 H Surface are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the P 22 H Surface is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]waferpedia.com — waferpedia.comwaferpedia.com
- [3]Inventory photo
- [4]KLA P 22 H Surface vs KLA P 22 Surface comparison | Waferpedia — waferpedia.comwaferpedia.com
- [5]KLA P-2 vs KLA P 22 H Surface comparison | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 10, 2026.
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