3D

The KY8030 series is a set of True 3D solder paste inspection platforms. The series includes three configurations: the KY8030-2 for general coverage, the KY8030-3 for high-volume throughput, and the KY8030 USX for extra-long printed circuit boards. The KY8030-2 inspects at inspection speeds from 11.1 to 59.5 cm²/sec with paste height up to 450 microns and at pixel resolutions of 10, 15, 20, or 25 microns. The KY8030-3 achieves roughly twice the throughput of the KY8030-2, reaching 81.85 cm²/sec at 8 megapixel resolution and 20 micron pixel resolution, with an inspection height of 400 microns.^[2][3]

Koh Young’s True 3D AOI and SPI systems use a patented 3D dual-inspection Moiré projection method. Two projection directions are employed to eliminate shadows and specular reflections that degrade the measurements of single-projection systems. The equipment measures true profilometric volume, area, height, offset, bridging, shape deformity, and coplanarity of paste deposits or assembled components, rather than relying on two-dimensional image comparison.^[1][2]

The KY8030 series features active warp compensation that maintains measurement accuracy even on bowed substrates. The Z-resolution of the KY8030-3 is 0.37 microns with a height accuracy of 1 micron. An optional automated solder paste dispensing system can perform auto-rework within the same machine.^[3][2]

The Zenith AOI series includes a side-view camera that extends inspection coverage to leadless chips, connectors, SOJs, QFNs, and partially shielded components. The systems incorporate self-diagnosis modules that periodically check 3D/2D light intensity, PZT feed, height accuracy, and XY offset to enable predictive maintenance.^[1]

Automated optical inspection from Koh Young is typically positioned after the reflow soldering process. The system inspects fully assembled printed circuit boards for component presence, polarity, solder joint quality, and foreign material, and it can report measurements according to the IPC-A-610 acceptance standard. The same True 3D measurement data can be fed into the KSMART line-wide process control system for real-time optimization.^[1][2]

Koh Young True 3D SPI systems are used to inspect solder paste deposits on printed circuit boards before component placement. The KY8030-3 additionally supports inspection of conductive glue and sinter paste, making it applicable to advanced packaging and non-solder joining processes.^[2][3]

The Zenith AOI series inspects assembled boards for component defects, solder joint quality, and foreign material. The systems are used across sectors such as automotive, aerospace, medical, telecom, industrial, and semiconductor packaging. The USX extended-length configuration of the KY8030 addresses extra-long boards such as backplanes, server panels, and power assemblies.^[1][3]