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Lam Research

2300 Exelan Flex Dielectric

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Lam 2300 Exelan Flex is a dielectric etch system. The Lam 2300 Exelan Flex is designed for sub-90nm technology nodes. The Flex variant adds a 60MHz ICP source for low-k etch at sub-65nm nodes.[1][2][3][4]

Lam Research logo
Fig. — Manufacturer logo, not a photo of this toolWikimedia Commons (see file page for license)

What it is

The Lam Research 2300 Exelan Flex is a semiconductor manufacturing tool classified as a dielectric etch system. The system is configured to process wafers up to 300 mm in diameter.[2][3][4][1]

How it works

The 2300 Exelan Flex uses a radio-frequency (RF) inductively coupled plasma (ICP) source. The Flex variant operates with a 60 MHz ICP, while related variants use a 13.56 MHz source. The RF matching network is a component of the RF delivery system.[1]

Where it fits in the process flow

General reference — not yet source-verified

The dielectric etch step typically follows the deposition of an insulating layer and the patterning of a photoresist mask that defines the areas to be removed. After etching, the remaining mask is stripped, and the wafer proceeds to subsequent manufacturing stages.

Applications

The 2300 Exelan Flex is used for etching dielectric materials including silicon dioxide, silicon nitride, and low-k dielectrics.[1]

Why won't it start?

Documented failure modes, common issues, and field considerations.

  • Used Exelans lack modern diagnostics like in-situ OES monitoring.

What do the numbers mean?

Power & electrical1

ICP source frequency
13.56MHz for Exelan HP; 60MHz for Flex variant[1]
Accurate?

Wafer handling1

Wafer size
300mm[4]
Accurate?

Configuration & options2

Max ICP power (HP variant)
3000W[1]
Accurate?
Technology node
sub-65nm for Flex variant; 90nm for HP variant[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
2300 Exelan HP (High Productivity)——Uses 13.56MHz ICP source with 3000W max power; ideal for oxide etch at 90nm. May lack 60MHz ICP for low-k etch.caladansemi.com[1]
Exelan Classic (pre-2005)——Pre-2005 variant; lacks sub-100nm uniformity. Avoid for sub-100nm nodes.caladansemi.com[1]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • ICP source frequency13.56MHz for Exelan HP; 60MHz for Flex variant[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

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Frequently asked questions

What is the Lam Research 2300 Exelan Flex?

The Lam Research 2300 Exelan Flex is a semiconductor manufacturing tool classified as a dielectric etch system.[2][3][1]

What power source does the Exelan Flex use?

The Exelan Flex uses an inductively coupled plasma (ICP) source. The Flex variant adds a 60 MHz ICP.[1]

What are the main components maintained in the vacuum chamber?

Maintained components in the vacuum chamber include the chamber liners, the e-chuck, heater coils, and the heater plate.[5]

What dielectric materials can the system etch?

The system is used for etching oxide, nitride, and low-k dielectric materials.[1]

Not publicly documented

The following facts about the 2300 Exelan Flex Dielectric are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2300 Exelan Flex Dielectric are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the 2300 Exelan Flex Dielectric are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • The process node or technology generation of the 2300 Exelan Flex Dielectric is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the 2300 Exelan Flex Dielectric are on record.

    Answerable by: an OEM parts catalog or a service engineer

  • No publicly hosted manuals, SOPs, or datasheets for the 2300 Exelan Flex Dielectric are on record.

    Answerable by: university cleanroom staff or an OEM application specialist

Sources & citations

Sources (5)Every fact above is drawn from these public sources
  1. [1]caladansemi.com — caladansemi.comcaladansemi.com
  2. [2]Equipment inventory listing
  3. [3]LAM Research 2300 Exelan Flex Dielectric Etch for sale — fabsurplus.comfabsurplus.com
  4. [4]fabsurplus.com — fabsurplus.comfabsurplus.com
  5. [5]https://www.foamtecintlwcc.com/wp-content/uploads/2023/09/lam-2300-flex-oxide-etch.pdf — foamtecintlwcc.comfoamtecintlwcc.com
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Last updated Oct 2, 2026.

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