Laurell
H6-15
The Laurell H6-15 is a spin coater. The Laurell H6-15 accommodates up to 300mm wafers. The Laurell H6-15 has a maximum rotational speed of 12,000 RPM based on a 100mm silicon wafer.[1][2][3]
Wafer size
300mm
Power
95 to 240VAC, 47/63HZ, ~300 Watts[1]
Vacuum
25–28 inches Hg[1]
Gas delivery
60–70 PSIG Nitrogen/CDA[1]
What it is
How it works
The H6-15 uses a vacuum chuck to hold substrates during rotation.[1][3][2]
The H6-15 includes a wireless tablet with Laurell Touch process control software, and the controller can also be used with Spin 3000 on a PC.[1][3][2]
The H6-15 is used with a closed bowl, exhaust, drain, and chemical-resistant chamber features that help control splashing and contamination during coating.[1][3][2]
Where it fits in the process flow
Applications
The H6-15 accommodates wafers up to ø 300 mm and substrates up to 9 inches by 9 inches.[1][3][2]
The H6-15 has a maximum rotational speed of 12,000 RPM based on a ø 100 mm silicon wafer.[1][3][2]
The H6-15 is intended for processing that includes coating, etching, developing, rinsing-drying, and cleaning in solvent, base, or acid-based chemistries.[1][3][2]
- Coating
- Etching
- Developing
- Rinsing-Drying
- Cleaning
- Glove box processing
- Solvent-based processing
- Base-based processing
- Acid-based processing
What do the numbers mean?
Power & electrical1
Vacuum & pumping2
Wafer handling5
Gas & chemistry1
Control & software3
Dimensions & facilities1
Configuration & options3
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What substrate sizes does the H6-15 accept?
The H6-15 accommodates wafers up to ø 300 mm and substrates up to 9 inches by 9 inches.[1][3][2]
What is the maximum rotational speed?
The H6-15 has a maximum rotational speed of 12,000 RPM based on a ø 100 mm silicon wafer.[1][3][2]
Not publicly documented
The following facts about the H6-15 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the H6-15 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the H6-15 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the H6-15 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the H6-15 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the H6-15 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]web.archive.org — web.archive.orgweb.archive.org
- [3]web.archive.org — web.archive.orgweb.archive.org
Last updated Oct 5, 2026.
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